From IBM today:
At the annual Design Automation Conference IBM today announced new semiconductor products that leverage several IBM-generated chip technology breakthroughs. One of these offerings, IBM’s new Cu-45 High Performance Custom Chip (ASIC), represents the commercial introduction of Silicon On Insulator (SOI) technology — historically only used for high performance microprocessors — into communications, consumer and other major market segments. In addition, the Cu-45HP ASIC offering is the first commercial use of a new generation of embedded dynamic random access memory (eDRAM) implemented in Silicon-on-Insulator (SOI) technology — an innovation introduced February 2007 at the International Solid State Circuits Conference (ISSCC).
Lots more details in the full release, including announcements on communications and mobile chip technology.