The HyperTransport Consortium, today, announced two new connector/cable specifications that allow platform and peripheral vendors new ways of interconnecting devices. The new specs define a set of compact, standardized connectors and cables that are capable of carrying the full 3.2Ghz HT clock rate over distances of up to 2 meters. The goal being to enable new board-to-board, system-to-subsystem, system-to-appliance and chassis-to-chassis interconnect solutions for applications such as motherboards, special function subsystems, servers, blade servers and server clusters.
We have evolved HyperTransport from the well established role of high performance chip-to-chip interconnect standard, to a full-fledged role of first and only system-wide interconnect standard capable of fulfilling the industry’s most demanding commercial and scientific computing requirements,” said Mario Cavalli, general manager of the HyperTransport Consortium. “Together, the HNC and Connector specifications enable highly scalable, heterogeneous, fully hardware-virtualized and modularized resource-sharing computing platforms that support global shared memory architectures. These are best suited to deliver the performance, energy efficiency and cost optimization that data center and high performance computing markets need going forward.”
The new spec is a result of a collaboration with the HT Consortium’s Technical Working Group [TWG] and Samtec, Inc.
“HyperTransport technology delivers leading-edge performance that is the perfect match and proving ground for our interconnect technology expertise,” said David Givens, director of standards and development manager of Samtec, Inc. “Our close cooperation with the HyperTransport Consortium team has enabled us to develop and standardize state-of-the-art interconnect solutions that we expect will open new, enabling opportunities for system design engineers and scalable computing architects.”
For more info on the physical and electrical specifications, read their full release here.