This week FPGA manufacturer Xylinx announced that it can beat Moore’s Law by using stacked silicon interconnects. Using the “industry’s first stacked silicon interconnect technology,” the company is using multiple FPGA die in a single package for applications that require high-transistor and logic density. Using this unique 3D packaging will enable the company’s 7 Series FPGAs to have unprecedented capacity of up to two million logic cells.
Widely used in scientific and military applications, FPGAs form the basis of chips designed by firms like ARM. New FPGAs like this could help ARM introduce new cores in chip designs that wind up in smartphones and possibly even tomorrow’s low power servers.