In this video, Wade Vinson provides a tour of HP’s next-gen modular data center.
Last month HP unveiled the EcoPOD, its next-generation modular data center, which comes equipped with the capability to use outside air to cool up to 44 racks of gear in a “double-wide” design with two rows of cabinets.
According to Marc Hamilton, HP’s Vice President of HPC, the EcoPOD requires six semi-trailers to ship and is assembled on site. A tip of the hat goes to Datacenter Knowledge for pointing us to this story.
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