EPFL scientists have developed a new generation of 3D computer chips that stacked vertically rather than placed side by side. The technology may someday enable faster, higher bandwidth processing.
EPFL scientist are among the leaders in the race to develop an industry-ready prototype of a 3D chip as well as a high-performance and reliable manufacturing method. The chip is composed of three or more processors that are stacked vertically and connected together—resulting in increased speed and multitasking, more memory and calculating power, better functionality and wireless connectivity.
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