Today Eurotech announced that the company has teamed up with AppliedMicro Circuits Corporation and NVIDIA to develop a unique HPC system architecture that combines extreme density and best-in-class energy efficiency.
We are excited and proud of this new development we have undertaken with Applied Micro and NVIDIA,” said Giampietro Tecchiolli, Eurotech CTO. ”The new architecture we have developed is highly optimized for High Performance Computing applications and delivers amazing density and energy efficiency. We expect to introduce products based on this revolutionary architecture in the very near future.”
Systems leveraging the new architecture can have a novel form factor that enables an innovative way of packaging electronics and water cooling, leaving no space unutilized and boasting an impressive computational density, with a peak performance of 1 PFlop/s in one square meter. The new system also exploits the latest generation of the Eurotech’s patented direct hot liquid cooling, which allows “free cooling” even in the warmest climates on earth and features industry-leading PUE efficiency ratings.
