Today Asetek announced that the company will showcase its full range of RackCDU liquid cooling systems for HPC data centers at SC14. Located at booth #951, Asetek will feature installations and customer stories from organizations such as The University of Tromso, Mississippi State University, Lawrence Berkeley National Laboratory (LBNL) and the U.S. Army’s Sparkman Center Data Center. CPU and GPU blades sold by Cray in its CS300-LC and CS-400-LC cluster supercomputers will also be on display.
Asetek’s RackCDU range includes RackCDU D2C (Direct-to-Chip) and RackCDU ISAC (In-Server Air Conditioning). RackCDU D2C provides cooling energy savings greater than 50% and density increases of 2.5x-5x. RackCDU ISAC is a sealed server solution which captures over 90% of heat load into liquid and enables operation without concern for air quality.
Asetek believes in the importance of HPC, but the fact is that HPC faces challenges. Because these supercomputers and clusters are so powerful, they consume substantial amounts of power and require significant cooling,” said André Sloth Eriksen, Founder and CEO of Asetek. “That’s why Asetek is working to provide solutions that allow HPC to thrive by reducing energy demand and cooling costs.”
For more than two decades, the SC Conference has been the place to build and share the innovations that are making these life-changing discoveries possible. For SC14, SC is going back to New Orleans with new ideas and a fresh take on HPC. Spotlighting the most original and fascinating scientific and technical applications from around the world, SC14 will once again bring together the HPC community.
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