Europe is at the forefront of HPC. Asetek’s liquid cooling helps HPC sites address key European issues of high energy costs and waste energy reuse,” said John Hamill, Vice President, Worldwide Sales, Asetek. “We are particularly pleased to feature production systems from Fujitsu and Cray at this year’s conference along with advanced cooling designs for high performance silicon that will be coming to market.”
Asetek will showcase its latest liquid cooled servers including Fujitsu’s CX400 Scale-Out Smart servers and Cray’s CS400-LC cluster supercomputers. Also on display will be liquid cooling solutions designed for overclocking IBM Power processors and OpenPower servers as well as solutions for Intel’s upcoming Knights Landing (KNL) Bootable MIC.
Asetek will be highlighting HPC installations from around the world utilizing Asetek’s Direct to Chip (D2C) cooling solutions. Those featured at the booth include The University of Tromsø, Sandia National Laboratories, Mississippi State University and the U.S. National Renewable Energy Laboratory. Additionally, Asetek will be presenting at the ISC Exhibitor’s Forum on Tuesday, July 14 from 4:40 pm – 05:00 pm. The presentation will discuss real world installations of liquid cooling in use today by HPC data centers.
RackCDU is Asetek’s innovative hot water, direct-to-chip, data center liquid cooling technology, which removes heat from CPUs, GPUs, memory modules and other hot spots within servers, using an all-liquid path and rejecting the heat into ambient outdoor air without chilling.