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CoolIT Systems Lands New Patents for Liquid Cooling

CoolIT_weblogo3Today CoolIT Systems announced that the U.S Patent and Trademark Office has granted the company three new patents in the space of liquid cooling. These patents bring CoolIT’s patent portfolio to 50 issued patents and represent the company’s continued commitment to innovation in data center cooling.

Driving innovation for datacenter cooling solutions continues to be a core part of our activities,” said Geoff Lyon, CEO of CoolIT Systems. “Our goal as an organization is to create innovative products that can efficiently cool the massive datacenters that are being built today. The fact is that the demand for data will double and then double again in the next few years, so we have to look for ways to deliver that data using less electricity for both ecological and economic reasons.”

Newly issued patents:

  • USPTO 9057567 Microchannel Coldplate protects a sophisticated method of managing the fluid flow through a microchannel cold plate to maximize the efficient transfer of heat from a microprocessor into a liquid flow while minimizing the pressure drop and the physical size of the cold plate. This invention further ensures the exclusive advantage that CoolIT liquid cooling system designs have over competitive systems by minimizing the pumping power to effectively cool thermally dense processors of today and tomorrow.
  • USPTO 9052252 Leak Detection System is a sensor system compatible with all existing server platforms that provides instant notification if any moisture or condensation were to form inside the server. This system seamlessly communicates to any server’s existing diagnostic monitoring system like BMC or IPMI.
  • USPTO 9055697 Air Conditioning System Control describes a method to automatically map and monitor the temperature distribution in an entire data center. By using this technology, a data center operator can optimize the cooling resources on a very granular basis and therefore minimize the power consumption required to adequately and efficiently cool the datacenter equipment.

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