Today Asetek announced an OEM purchase agreement with HPC vendor Penguin Computing. As a part of the agreement, Penguin will incorporate Asetek’s RackCDU D2C liquid cooling technology into its Tundra Extreme Scale (ES) HPC server product line. RackCDU direct-to-chip hot water liquid cooling enhances Penguin’s ability to provide HPC solutions with extreme energy efficiency and higher rack cluster densities. The agreement has already resulted in an order by Penguin described in a previously anonymous announcement.
Compute density, power and cooling efficiency, and associated performance gains are critical elements of the solutions we deliver to HPC customers,” said Dan Dowling, Vice President of Engineering Services, Penguin Computing. “Asetek has helped us develop a solution that meets tomorrow’s energy efficiency and density requirements.”
Along with the announced agreement, Penguin and the National Nuclear Security Administration’s (NNSA) Lawrence Livermore National Laboratory announced the Asetek enabled Tundra system had been selected for the NNSA’s tri-laboratory Commodity Technology Systems programs (CTS-1) at Los Alamos, Sandia and Lawrence Livermore national laboratories. The resulting deployment of these supercomputing clusters will be one of the world’s largest Open Compute-based installations. The order and OEM relationship is anticipated to result in between $1.0M and $1.5M of revenue within the first 12 months. Production to fulfill the order is expected to start within the next few months.
“As we add another OEM to our growing portfolio of RackCDU technology partners, our strategy of liquid cooling data centers is further validated,” said André Sloth Eriksen, Founder and CEO of Asetek. “The CTS-1 installation is a major win for Penguin and is Asetek’s largest server installation to date, confirming the momentum of RackCDU in the marketplace. We expect further sales from this partnership to make clear that Asetek liquid cooling is the proven solution for solving today’s data center constraints.”
RackCDU is Asetek’s innovative hot water, direct-to-chip, data center liquid cooling technology, which removes heat from CPUs, GPUs, memory modules and other hot spots within servers, using an all-liquid path and rejecting the heat into ambient outdoor air without chilling. As validated by Lawrence Berkeley National Labs, RackCDU enables cooling savings in excess of 50%, density increases of 2.5x to 5.0x, and recovery of all the server energy removed by RackCDU for reuse in facility heating and cooling.