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Video: Intel 3D XPoint Technology


 

3D Xpoint™ technology is up to 1000x faster than NAND and an individual die can store 128Gb of data.

3D Xpoint™ technology is up to 1000x faster than NAND and an individual die can store 128Gb of data.

In this video from the Disruptive Technologies Session at the 2015 HPC User Forum, Intel’s Ralph Biesemeyer presents: Intel 3D XPoint Technology.

“For decades, the industry has searched for ways to reduce the lag time between the processor and data to allow much faster analysis,” said Rob Crooke, senior vice president and general manager of Intel’s Non-Volatile Memory Solutions Group. “This new class of non-volatile memory achieves this goal and brings game-changing performance to memory and storage solutions.”

Download the Slides (PDF)

See more talks from the HPC User Forum

In related news, the HPC User Forum has posted their Agendas for upcoming meetings in Europe:

  • GENCI will host the HPC User Forum in Paris Oct. 12-13. The agenda includes speakers from Airbus, GENCI, Renault, and NASA. The meeting is free to attend. Register now.
  • LRZ will host the HPC User Forum in Munich Oct 15-16. The agenda includes speakers from LRZ, CSCS, DKRZ, Paypal, and the Gauss Centre for Supercomputing. The meeting is free to attend. Register now.

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