In this video from SC15, Steve Branton from Asetek describes the company’s momentum with liquid cooling in terms of growing OEM partnerships, customer installations, and new devices for emerging devices with ever-increasing core counts.
Asetek showcased its full range of RackCDU hot water liquid cooling systems for HPC data centers at the conference. On display were early adopting OEMs such as CIARA, Cray, Fujitsu, Format and Penguin. HPC installations from around the world incorporating Asetek RackCDU D2C (Direct-to-Chip) technology were also be featured. In addition, liquid cooling solutions for both current and future high wattage CPUs and GPUs from Intel, Nvidia and OpenPower were on display.
“At SC15, the HPC community will have the opportunity to discover the value of Asetek’s technology as demonstrated by its growing list of installations and OEMs around the world,” said John Hamill, VP Worldwide Sales and Marketing. “Because liquid is 4,000 times better at storing and transferring heat than air, Asetek’s solutions provide immediate and measurable benefits to large and small data centers alike, including reduced OpEx and CapEx and higher server density and performance.”
Asetek’s range includes RackCDU D2C (Direct-to-Chip), RackCDU ISAC (In-Server Air Conditioning), and Internal Loop Liquid Cooling. RackCDU D2C provides cooling energy savings greater than 50% and density increases of 2.5x-5x. RackCDU ISAC is a sealed server solution which captures over 90% of heat load into liquid and enables operation without concern for air quality. Internal Loop is liquid enhanced air cooling for server nodes that replaces less efficient air coolers and enables the servers to incorporate the highest performing CPUs and GPUs.