The 2016 Hot Interconnects Conference has issued its Call for Papers. The event takes place August 24-26 at Huawei in Santa Clara, California.
Hot Interconnects is the premier international forum for researchers and developers of state-of-the-art hardware and software architectures and implementations for interconnection networks of all scales, ranging from multi-core on-chip interconnects to those within systems, clusters, datacenters and Clouds. This yearly conference is attended by leaders in industry and academia. The atmosphere provides for a wealth of opportunities to interact with individuals at the forefront of this field.
Themes include cross-cutting issues spanning computer systems, networking technologies, and communication protocols for high-performance interconnection networks. This conference is directed particularly at new and exciting technology and product innovations in these areas. Contributions should focus on real experimental systems, prototypes, or leading-edge products and their performance evaluation. In addition to those subscribing to the main theme of the conference, contributions are also solicited in the topics listed below.
Building on last year’s successful technical program, keynotes, sessions, and panels on datacenter networking and their requirements, and solutions, in 2016 Hot Interconnects moves to the Huawei North America Headquarters, Santa Clara, CA for the conference. This year’s conference focuses on data-center, virtualized, and cloud networking.
- Novel and innovative interconnect architectures
- Multi-core processor interconnects
- System-on-Chip Interconnects
- Advanced chip-to-chip communication technologies
- Optical interconnects
- Protocols and interfaces for inter-processor communication
- Survivability and fault-tolerance of interconnects
- High-speed packet processing engines and network processors
- System and storage area network architectures and protocols
- High-performance host-network interface architectures
- High-bandwidth and low-latency I/O
- Pb/s switching and routing technologies
- Innovative architectures for supporting collective communication
- Novel communication architectures to support cloud computing
- Centralized and distributed cloud interconnects
- Requirements driving high-performance interconnects
- Traffic characterization for HPC systems and commercial datacenters
- Software for Network/Fabric Bring-up, Configuration and Performance
Management, e.g., OpenFlow or OpenSM
- Data Center networking
Abstracts are due May 6, 2016.