Sign up for our newsletter and get the latest HPC news and analysis.
Send me information from insideHPC:


TYAN Servers and Motherboards Add Support for Broadwell Processors

TyanToday TYAN announced support for the new Intel Xeon processor E5-2600 v4 product family (Broadwell). Incorporating Intel’s new processor technologies allows TYAN to offer the latest performance and power savings features available. TYAN’s Xeon E5 platform-based server systems and motherboards continue to offer the high performance, power efficiency, and required reliability on the market.

The latest Intel Xeon processor E5-2600 v4 product family is built upon an advanced 14nm process technology and increases the core and thread count per socket. These new processors allow us to offer the latest in memory speed and capacity, energy efficiency, and performance. This lets our customers run their applications in the best possible environment,” said Albert Mu, Vice President of MITAC Computing Technology Corporation’s TYAN Business Unit. “TYAN’s Dual-Socket Intel Xeon processor E5-2600 v4-based platforms are now capable of offering up to 44 cores and 88 threads per motherboard along with 1.5TB of DDR4-2400 memory speed, which enables enterprise and datacenter customers to benefit from the latest advances in cloud computing, HPC, and storage applications.”

TYAN designs, manufactures and markets advanced x86 and x86-64 server/workstation board and system products. The products are sold to OEMs, VARs, System Integrators and Resellers worldwide for a wide range of applications. TYAN enable customers to be technology leaders by providing scalable, highly-integrated and reliable products such as appliances for cloud service providers (CSP) and high-performance computing and server/workstation used in CAD, DCC, E&P and HPC markets.

“The new Intel Xeon processor E5-2600 v4 product family delivers the outstanding performance, power efficiency, increased orchestration capabilities and enhanced security to span the diverse needs of next-generation datacenters,” said Lisa Spelman, Vice President, Intel Data Center Group, and General Manager, Intel Xeon Products. “Our collaboration with TYAN helps drive innovation on Intel’s leading-edge technologies to address the needs of the broad range of workloads delivered via the next generation of cloud computing.”

Sign up for our insideHPC Newsletter

Resource Links: