Today CoolIT Systems announced a commercial partnership with STULZ USA. Under the agreement, the two companies will cooperate closely in delivering unique Chip-to-Atmosphere solutions across the globe.
STULZ has identified Chip-to-Atmosphere cooling solutions as a growing market segment for data center environments,” said Joerg Desler, President of STULZ USA. “This alliance with CoolIT allows us to offer customers more complete solutions that involve capturing the heat at source inside the servers and moving it out to the atmosphere with STULZ technology.”
CoolIT’s DCLC technology uses the exceptional thermal conductivity of liquid to provide concentrated cooling to the hottest components inside a server, enabling very high density configurations. CoolIT’s centralized pumping liquid cooling solutions can be tailored to any server layout and have already been adopted by many server manufacturers as a reliable technology that is covered under standard warranties.
“Partnering with such an influential solution provider as STULZ provides a tremendous worldwide capacity to our company,” said Geoff Lyon, CEO & CTO at CoolIT Systems. “This strategic relationship increases our ability to better serve the data center industry with forward thinking designs, solutions and services.”
The Chip-to-Atmosphere concept will be discussed in detail at ISC High Performance 2016 (ISC16) in Frankfurt during CoolIT Systems Exhibitor Forum Presentation: 4.40pm on Tuesday 21 June at Booth #500, Hall 3, Messe Frankfurt. Technical experts will also be available during ISC16 to answer any questions at CoolIT Systems booth, #1210.
CoolIT Systems is attractive to the global STULZ Group because they align well with STULZ’ history of bringing innovation and highly efficient technology to the data center market,” said STULZ USA Vice President Brian Hatmaker. “We see a growing need in the market for more flexible solutions to support high performance and high density compute applications. Chip-to-Atmosphere solutions will generate immediate CAPEX and OPEX savings with minimal footprint requirements.”