Today CoolIT Systems rolled out its new CHx80 Heat Exchange Module. As part of an expanded its Rack DCLC product line, this next generation liquid-to-liquid heat exchanger provides cooling capacity with N+1 reliability to manage the most challenging, high density HPC racks. CoolIT will showcase the rack-mount CHx80 at ISC16 in Frankfurt.
The Rack DCLC CHx80 Module is an incredible advancement for enterprise-class high-performance computing, and with such a compact form factor, this level of power density is unrivaled in today’s marketplace,” says CoolIT Systems Senior Product Manager, Pat McGinn. “CHx80 Module stands alone as the clear option for liquid cooled racks for now and for the future.”
The new CHx80 delivers 80kW of heat load capacity in a remarkably small 4U of space. This rack-mounted system supports cooling for 120 servers, providing sufficient capacity for the most ambitious HPC system planner. The N+1 redundancy design also ensures continuous productivity for customers.
Warm water cooling is standard at CoolIT; the CHx80 employs an extremely efficient heat exchanger that utilizes ASHRAE W3-W5 (2°C – 45°C). This warm water manages the processor and component heat, eliminating the need for chillers. Customers deploying the CHx80 Module can expect a dramatic decrease in data center OPEX by using less energy for cooling and running fans, and even have the option to reuse the waste energy to heat surrounding buildings.
To ensure superior performance and reliability, the CHx80 Module features centralized pumping as well as a comprehensive control system which manages and reports on over 15 sensor locations within the system. The CHx80 Module can be managed locally via a 4.3” LCD screen or through several network protocols, and has a number of different operating modes that are customizable by the user to fit specific data center needs.
According to CoolIT, the CHx80 Module performs the final step of the company’s modular, three-step process in selecting a data center cooling solution.
Visit CoolIT at ISC 2016 booth #1210.