Today CoolIT Systems announced that the United States Patent and Trademark Office has issued U.S. Patent No. 9,496,200 covering modular heat-transfer solutions to cool an array of independent servers for rack based data center installations.
This proprietary modular heat-transfer system consists of a rack, heat-transfer elements (heat exchanger), component heat-exchange modules with distributed pumps, manifold module and a coolant heat-exchange module. CoolIT Systems has exclusive rights to the patented technology.
“U.S. Patent 9,496,200 protects the invention of utilizing a modular, building block approach for datacenter cooling with direct contact liquid cooling,” said Geoff Lyon CEO, CoolIT Systems. “CoolIT’s commitment to developing and patenting unique solutions provides our customers with the assured competitive advantage they are looking for. The 60 patent milestone adds confirmation to CoolIT’s leadership in developing innovative liquid cooling solutions for modern data centers.”
The latest patent comes just a month after CoolIT Systems was issued a related patent (U.S. Patent No. 9,453,691) that defines a fluid heat exchange system used to cool heat generating components of a computer with a fluid heat exchanger that splits a mass flow of coolant. This Split-Flow invention is another one of the company’s key performance differentiators. High levels of performance enable the effective cooling of server CPUs using very warm cooling liquid that eliminates the need for expensive chiller plants and bulky air conditioning units. The potential for reducing both the capital expense and on-going operating expense that direct contact liquid cooling provides is motivating adoption at an increasing rate.
The recently issued patents join CoolIT Systems growing intellectual property portfolio that includes more than 60 issued patents and numerous patent applications, to which CoolIT Systems has exclusive rights in the U.S. and major international markets.