It’s an incredibly exciting time in the industry as investments in next-generation Ethernet standards are coming to fruition. Our members – including equipment manufacturers, system and component vendors, test and measurement, and everyone else in-between – are developing the solutions that will enable these standards,” said John D’Ambrosia, chairman, Ethernet Alliance; and senior principal engineer, Huawei. “The diversity of solutions will allow network designers to tailor their network to their individual application’s bandwidth needs and specific requirements. With multiple application spaces refreshing near-simultaneously, we’re witnessing the largest aggregated build-out ever. In short, the next Ethernet era is off to a terrific start.”
As the role of optics in Ethernet is undeniable, the Ethernet Alliance’s OFC 2017 multivendor demo showcases a broad array of optical technologies, featuring 400G optics and form factors, cabling, and other emerging fiber innovations. The organization’s display encompasses two demonstrations, one focusing on a wide range of solutions ranging from 1G to 100G. The second demo integrates live 400G optical network connections from the Ethernet Alliance’s booth to four other autonomous member company booths on the expo floor. Reflecting the whole of the Ethernet ecosystem, these demos incorporate an extensive variety of switches, NICs, servers, cabling, fiber, and cutting-edge test equipment that provides data generation and real-time analysis. These technologies are the latest evolution in the Ethernet portfolio, and the foundation of the next Ethernet era.
With one of the highest rates of member company participation to-date, the Ethernet Alliance’s OFC 2017 demo features equipment and technologies from 16 different organizations, including Amphenol Corporation; Aquantia Corporation; Broadcom Limited; Cisco Systems; Finisar; Ixia; Juniper Networks; Mellanox; Molex, Inc.; Oclaro, Inc.; Panduit Corp.; Spirent Communications; TE Connectivity Ltd.; Teledyne LeCroy, Inc.; Viavi Solutions Inc.; and Xilinx.
This demo is much more than merely hooking up PHYs – it’s a true representation of the disruptive transformations taking place at every level of the Ethernet ecosystem. With member company participation among the highest it has ever been in Ethernet Alliance history, we have everything from interoperable real-world products available for immediate deployment, to forward-looking 400G technologies that will be the cornerstone of tomorrow’s high-speed networks, to state-of-the-art test and measurement tools needed for validating a new generation of links and devices,” said David J. Rodgers, board member and OFC 2017 technical lead, Ethernet Alliance; and senior product marketing manager, Teledyne LeCroy. “Our 400G demonstration highlights how IEEE 802.3™ standards facilitate interoperability, even at the pre-ratification stage. It’s another proof-point of Ethernet’s capacity to just plug in and perform as expected.”
In addition to its multivendor demo, the Ethernet Alliance is hosting an OFC 2017 panel entitled The Fracturing and Burgeoning Ethernet Market, where expert panelists will also discuss how the 100G market is simultaneously thriving and fracturing into numerous variants.
To experience the Ethernet Alliance’s live multivendor demo, please visit booth 3709 on the OFC 2017 expo floor.