Sign up for our newsletter and get the latest HPC news and analysis.
Send me information from insideHPC:


CoolIT Systems and STULZ Debut High Density Chip-to-Atmosphere Data Center Liquid Cooling

In this video, CoolIT Systems CEO & CTO, Geoff Lyon, and STULZ ATS President, Joerg Desler, discuss high density Chip-to-Atmosphere™ data center liquid cooling solutions for organizations big or small. When integrated, CoolIT Systems’ DCLC™ solutions can capture 85% and more of the servers’ heat directly into liquid. Complimenting DCLC™, STULZ precision air cooling products capture the balance of the lower density heat. A considerable benefit forms when the total heat energy from both systems is consolidated, transported outside and then dissipated or recaptured for reuse, to heat nearby buildings, for example.

Sugon Moves HPC as a Service to Europe with Arctur-2 Supercomputer

As announced at SC16, Chinese HPC vendor Sugon has built a new datacenter in Slovenia based around the Arctur-2 system, Sugon’s first installation in continental Europe and a major milestone in the company’s globalization strategy. “Arctur-2 is Sugon’s flagship hyperconverged HPC & Cloud computing infrastructure. According to Sugon, the system was designed and built to fit various and diverse usage scenarios, from general use Cloud Computing to HPC computing as well as Big Data analytics. By converging different types of servers into single entity we achieved high performance, energy efficiency and seamless management, Sugon is able to provide an HPC on demand to its customers.”

Video: Building the Owens Cluster at OSC

In this time-lapse video, engineers build the Owens cluster at the Ohio Supercomputing Center. “Named after Olympic track star Jesse Owens, the new Owens Cluster is be powered by Dell PowerEdge servers featuring the new Intel Xeon processor E5-2600 v4 product family, include storage components manufactured by DDN and an EDR interconnect provided by Mellanox. The center earlier had acquired NetApp software and hardware for home directory storage.”

RSC Tornado Breaks Record with 1.41 Petaflops per Rack

Today Russia’s RSC Group announced that the company has achieved a record compute density of 1.41 Pflops per rack using direct liquid cooling and Intel Xeon Phi processors. “RSC supported the TUM student team from Munich with 8 nodes mobile cluster based on RSC Tornado direct liquid cooled architecture. This computing system provided stable operation of computing nodes in “hot water” mode at +63 °С cooling agent temperature at node inputs and had the following configuration: 72-cores Intel Xeon Phi 7290 processors, Intel S7200AP server boards, Intel SSD DC S3500 Series M.2 340 GB solid-state drives, switch and adapters based on Intel Omni-Path high-speed fabric, highly efficient Micron DDR4-2400 VLP 16-32 GB memory modules.”

Video: PASC17 Conference Seeks Papers, Minisymposia, and Posters

In this video, Jeff Hollingsworth from SIGHPC and Michele De Lorenzi from CSCS invite you to submit papers, minisymposia proposals and posters to the PASC17 Conference, an interdisciplinary conference in HPC that brings together domain science, applied mathematics and computer science. PASC17 will be held June 26-28, 2017 in Lugano, Switzerland.

Japan to Build 130 Petaflop ABCI Supercomputer

Today Japan announced plans to build a 130 Petaflop (half precision) supercomputer for deployment in 2017. And while such a machine would not surpass the current #1 93 Petaflop Sunway TaihuLight supercomputer in China, it would certainly propel Japan to the top of an all new category of supercomputing leadership. “ABCI is an open innovation platform with computing resources of more than hundred petaflops for world-class AI R&D. Through industry and academia collaboration, Algorithms, Big Data, and Computing Power will be leveraged in a single common public platform. ABCI will rapidly accelerate the deployment of AI into real businesses and society.”

Podcast: John McCalpin Surveys HPC System Memory Bandwidth

“In the long run, if you need orders of magnitude more bandwidth than is currently available there’s a set of technologies that are sometimes referred to as processor in memory – I call it processor at memory – technologies that involves cheaper processors distributed out to adjacent to the memory chips. Processors are cheaper, simpler, lower power. That could allow a significant reduction in cost to build the systems, which allows you to build them a lot bigger and therefore deliver significantly higher memory bandwidth. That’s a very revolutionary change.”

Full Rundown of SC16 Stats, World Records, and Awards

The numbers are in for SC16, the international supercomputing conference that wrapped up last week in Salt Lake City. The conference drew more than 11,100 registered attendees and featured a technical program spanning six days. “The SC16 Exhibition was the largest in the history of the conference, with 349 exhibitors from industry, academia and research organizations from around the world.”

Video: Supermicro Showcases Machine Learning Solutions on Intel Architecture

In this video from the Intel HPC Developer Conference, Akira Sano from Supermicro describes the company’s Machine Learning Solutions on Intel Architecture. “Our server systems, subsystems and accessories are architecturally designed to provide high levels of reliability, quality and scalability, thereby enabling our customers benefits in the areas of compute performance, density, thermal management and power efficiency to lower their overall total cost of ownership.”

Asetek Liquid Cooling Delivers Savings and Flexibility for HPC

In this video from SC16, Steve Branton from Asetek describes the company’s innovative liquid cooling systems for high performance computing. Unlike one-size-fits-all approaches, the flexibility of Asetek distributed liquid cooling technology enables OEMs to provide a fit-to-need strategy that is compelling to the elite members of the supercomputing community. “With the accelerating trend of higher wattages and the continuing requirement of high density, the need for adaptable, cost effective, and reliable liquid cooling is accelerating among those striving to obtain TOP500 status. This need is exactly what Asetek’s distributed cooling architecture provides.”