Trillions for Chips: A Roiled Semiconductor Industry Strains to Meet AI Demand

We’re seeing the chip industry’s version of the scientific aphorism: “nature hates a vacuum.” The vacuum is the short supply of – and vast demand for – AI chips, and it’s roiling the semiconductor industry. Chip foundry companies TSMC, Intel and Samsung are straining to expand GPU fab capacity….

HPC News Bytes: Eni’s Monster HPE Supercomputer, Intel’s New Mexico Fab, NSF’s AI Research Resource, D-Wave and IonQ Quantum Advancements

A good January morning to you! It was an interesting week in HPC-AI, here’s a rapid (6:07) rundown of the latest doings, including: Italy energy giant Eni’s 600 PFLOPS HPE supercomputer, Intel opens….

Intel Announces AI-Oriented 5th Gen Xeon, Provides Gaudi3 GPU Accelerator Sneak Peak

Gearing up for what it intends to be a multi-horse race in the exploding AI chip sector, Intel today announced a next-generation Xeon enterprise and data center CPU built with AI inferencing in mind, along with mobile processors targeting “AI PC,” and an advance look from Intel CEO….

HPC News Bytes 20231211: AMD’s MI300, Quantum in the News, Linux Foundation’s 2 New Projects, EU AI Regulations, ISC Extends Deadlines

A happy deep and dark December morning to you! Here’s a sprint (5:28) through recent HPC-AI news, including: AMD MI300, the Q2B quantum conference and other quantum news, the Linux Foundation’s new projects….

Taking on NVIDIA: AMD Announces Availability of MI300 GPU Accelerators

After years of NVIDIA having its dominant way in the GPU AI chip market — a market that has exploded over the last 12 months with the emergence of generative AI — AMD today announced the availability of the long-awaited and much previewed MI300X accelerator chip (pictured here) that AMD intends to be a worthy competitor with NVIDIA’s H100….

HPC News Bytes 20231204: The New Yorker on NVIDIA, the Open Benchmark Council, Intel and TSMC, Digital Twins for Hydropower

Here’s a sprint (5:16) through the latest HPC -AI news, including: NVIDIA’s big feature story in The New Yorker, the Open Benchmark Council’s TOP100 lists, Intel and TSMC’s high-end 3 nanometer fab, digital twins for hydropower at ORNL and PNNL.

SC23: TOP500 Trends, the AI-HPC Crossover, Chiplet Standardization, the Emergence of UCIe and CXL Advancements

By Adrian Cockcroft, Partner & Analyst, OrionX Last year the UCIe chiplet standard had just been launched, and since then just about everyone has joined it, about 130 companies. The idea is that to build a complete CPU or GPU you don’t have to put it all on the same chip from the same….

At SC23: Lenovo’s Advancements in Liquid Cooling, Storage, Digital Twins and HPC-AI Software

[SPONSORED GUEST INTERIVEW] We spoke at the Lenovo booth with Andreas Thomasch, Director of HPC and AI, European Markets, in this sponsored interview about recent developments across critical HPC-AI challenge areas: Water Cooling: Lenovo was an….

At SC23: Immersive Virtual Reality on Display from Dell Technologies

[SPONSORED GUEST INTERVIEW] When HPC and AI converge remarkable things can result, and one of them is on display on the floor of the SC23 conference here in Denver at the Dell Technologies booth (#625). We encountered it ourselves, it’s an immersive VR….

NVIDIA Announces HGX H200 Systems and Cloud Instances

DENVER—SC23—Nov. 13, 2023—NVIDIA today announced the HGX H200 that is based on the Hopper architecture and features the H200 Tensor Core GPU with advanced memory to handle massive amounts of data for generative AI and high performance computing workloads. NVIDIA said the H200….