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Avere Speeds Hybrid Cloud at SC16

“Avere Hybrid Cloud is a groundbreaking solution that changes the economics and functionality of data storage and computing. Avere Hybrid Cloud enables companies to leverage public and private storage clouds, IaaS, and elastic compute for workloads previously limited to on-premises high-performance (HPC) storage systems. With Avere Systems, you can achieve unlimited performance scaling, eliminate latency and cut storage costs by more than 50%.”

HPE Goes All-Flash for Public Cloud with 3PAR, Lowers Long Term Storage Costs with Spectra Logic

Today HPE announced today a comprehensive initiative that brings together the best of on-premises performance, application availability, and control with the convenience and agility of public cloud consumption models.

SGI and DDN Power UK Met Office SPICE System for Weather and Climate Research

SGI, Bright Computing, and DDN recently announced that the UK Met Office has selected the three HPC vendors to provide HPC for its new Scientific Processing and Intensive Compute Environment (SPICE) system. SPICE will enable weather and climate researchers to dramatically reduce time required to analyze massive amounts of climate simulation data.

Simplify Cluster Deployment with Intel HPC Orchestrator

“Intel HPC Orchestrator simplifies the installation, management, and ongoing maintenance of an HPC system by reducing the amounft of integration and validation effort required to run an HPC system software stack. With Intel HPC Orchestrator, based on the OpenHPC system software stack, you can take advantage of the innovation driven by the open source community – while also getting peace of mind from Intel® support across the HPC system software stack.”

Nvidia’s Bill Dally to Keynote HiPINEB 2017 Exascale Workshop

Nvidia’s Bill Dally will keynote HiPINEB 2017 – the 3rd IEEE International Workshop on High-Performance Interconnection Networks in the Exascale and Big-Data Era. The event takes place Feb. 5, 2017 in Austin, Texas and will be held in conjunction with the IEEE HPCA Conference.

CoolIT Systems and STULZ Debut High Density Chip-to-Atmosphere Data Center Liquid Cooling

In this video, CoolIT Systems CEO & CTO, Geoff Lyon, and STULZ ATS President, Joerg Desler, discuss high density Chip-to-Atmosphere™ data center liquid cooling solutions for organizations big or small. When integrated, CoolIT Systems’ DCLC™ solutions can capture 85% and more of the servers’ heat directly into liquid. Complimenting DCLC™, STULZ precision air cooling products capture the balance of the lower density heat. A considerable benefit forms when the total heat energy from both systems is consolidated, transported outside and then dissipated or recaptured for reuse, to heat nearby buildings, for example.

Sugon Moves HPC as a Service to Europe with Arctur-2 Supercomputer

As announced at SC16, Chinese HPC vendor Sugon has built a new datacenter in Slovenia based around the Arctur-2 system, Sugon’s first installation in continental Europe and a major milestone in the company’s globalization strategy. “Arctur-2 is Sugon’s flagship hyperconverged HPC & Cloud computing infrastructure. According to Sugon, the system was designed and built to fit various and diverse usage scenarios, from general use Cloud Computing to HPC computing as well as Big Data analytics. By converging different types of servers into single entity we achieved high performance, energy efficiency and seamless management, Sugon is able to provide an HPC on demand to its customers.”

Video: Building the Owens Cluster at OSC

In this time-lapse video, engineers build the Owens cluster at the Ohio Supercomputing Center. “Named after Olympic track star Jesse Owens, the new Owens Cluster is be powered by Dell PowerEdge servers featuring the new Intel Xeon processor E5-2600 v4 product family, include storage components manufactured by DDN and an EDR interconnect provided by Mellanox. The center earlier had acquired NetApp software and hardware for home directory storage.”

RSC Tornado Breaks Record with 1.41 Petaflops per Rack

Today Russia’s RSC Group announced that the company has achieved a record compute density of 1.41 Pflops per rack using direct liquid cooling and Intel Xeon Phi processors. “RSC supported the TUM student team from Munich with 8 nodes mobile cluster based on RSC Tornado direct liquid cooled architecture. This computing system provided stable operation of computing nodes in “hot water” mode at +63 °С cooling agent temperature at node inputs and had the following configuration: 72-cores Intel Xeon Phi 7290 processors, Intel S7200AP server boards, Intel SSD DC S3500 Series M.2 340 GB solid-state drives, switch and adapters based on Intel Omni-Path high-speed fabric, highly efficient Micron DDR4-2400 VLP 16-32 GB memory modules.”

Video: PASC17 Conference Seeks Papers, Minisymposia, and Posters

In this video, Jeff Hollingsworth from SIGHPC and Michele De Lorenzi from CSCS invite you to submit papers, minisymposia proposals and posters to the PASC17 Conference, an interdisciplinary conference in HPC that brings together domain science, applied mathematics and computer science. PASC17 will be held June 26-28, 2017 in Lugano, Switzerland.