Over at Desktop Engineering, Wolfgang Gentzsch and Burak Yenier write that the new 2016 Compendium of Engineering Cloud Case Studies showcases great progress in CAE Cloud Computing. “In the early days of cloud computing, users complained that they got lost in the complexity of accessing and using cloud resources, and once using one cloud they were not able to easily use another cloud when needed. With the advent of software container technology for CAE and other applications this complexity disappeared.”
In this video, Dr. Kelly Gaither from TACC describes how 20 students identified by XSEDE’s community engagement team participated in a four-day long cohort experience themed around social change at SC16. “The objectives of the program are to engage students in a social change challenge using visualization and data analytics to increase awareness, interest, and ultimately inspire students to continue their path in advanced computing careers; to increase the participation of students historically underserved in STEM at SC.”
With modern processors that contain a large number of cores, to get maximum performance it is necessary to structure an application to use as many cores as possible. Explicitly developing a program to do this can take a significant amount of effort. It is important to understand the science and algorithms behind the application, and then use whatever programming techniques that are available. “Intel Threaded Building Blocks (TBB) can help tremendously in the effort to achieve very high performance for the application.”
“The PASC17 Conference offers a unique opportunity for your organization to gain visibility at a national and international level, to showcase your R&D and to network with leaders in the fields of HPC simulation and data science. PASC17 builds on a successful history – with 350 international attendees in 2016 – and continues to expand its program and international profile year on year.”
Today, high performance interconnects can be divided into three categories: Ethernet, InfiniBand, and vendor specific interconnects. Ethernet is established as the dominant low level interconnect standard for mainstream commercial computing requirements. InfiniBand originated in 1999 to specifically address workload requirements that were not adequately addressed by Ethernet, and vendor specific technologies frequently have a time to market (and therefore performance) advantage over standardized offerings.
Today ORNL announced the full schedule of 2017 GPU Hackathons at multiple locations around the world. “The goal of each hackathon is for current or prospective user groups of large hybrid CPU-GPU systems to send teams of at least 3 developers along with either (1) a (potentially) scalable application that could benefit from GPU accelerators, or (2) an application running on accelerators that need optimization. There will be intensive mentoring during this 5-day hands-on workshop, with the goal that the teams leave with applications running on GPUs, or at least with a clear roadmap of how to get there.”
In this video from SC16, Garima Kochhar from Dell EMC describes the CryoEM Demo on the Dell PowerEdge C6320 rack server powered by Intel Xeon and Intel Xeon Phi. “This demo presents performance results for the 2D alignment and 2D classification phases of the Cryo-electron microscopy (Cryo-EM) data processing workflow using the new Intel Knights Landing architecture, and compares these results to the performance of the Intel Xeon E5-2600 v4 family.”
“I think one of the things that resellers like about us is that we never take a reseller deal directly. As a channel-first company, we always drive as much business through channel as our customers allow,” said Philip Crocker, senior director of channel marketing and sales enablement at Panasas. “In addition, we have a high-quality yet low-certification entry cost to the program. We also allow 24 x 7 x 365 access to field sales engineers, are highly responsive to partners and have zero sales friction. Specifically, the Accelerate program is compensation-neutral for our sales representatives and distributors.”
In this time-lapse video, a team of volunteers build the SCinet, the world’s fastest network at SC16. “Created each year for the conference, SCinet brings to life a very high-capacity network that supports the revolutionary applications and experiments that are a hallmark of the SC conference. SCinet links the convention center to research and commercial networks around the world. In doing so, SCinet serves as the platform for exhibitors to demonstrate the advanced computing resources of their home institutions and elsewhere by supporting a wide variety of bandwidth-driven applications including supercomputing and cloud computing.”
The OpenFabrics Alliance (OFA) has issued its Call for Sessions for its 13th annual OFA Workshop. Registration is now open for the event, which takes place March 27-31, 2017 in Austin, TX.