Over at the ANSYS Blog, Tony DeVarco writes that the company worked with SGI to break a world record for HPC scalability. “Breaking last year’s 129,024 core record by more than 16,000 cores, SGI was able to run the ANSYS provided 830 million cell gas combustor model from 1,296 to 145,152 CPU cores.This reduces the total solver wall clock time to run a single simulation from 20 minutes for 1,296 cores to a mere 13 seconds using 145,152 cores and achieving an overall scaling efficiency of 83%.”
Maria Chan from NST presented this talk at Argonne Out Loud. “People eagerly anticipate environmental benefits from advances in clean energy technologies, such as advanced batteries for electric cars and thin-film solar cells. Optimizing these technologies for peak performance requires an atomic-level understanding of the designer materials used to make them. But how is that achieved? Maria Chan will explain how computer modeling is used to investigate and even predict how materials behave and change, and how researchers use this information to help improve the materials’ performance. She will also discuss the open questions, challenges, and future strategies for using computation to advance energy materials.”
The European Fortissimo Project has issued its Second Call for Proposals. Fortissimo is a collaborative project that enables European SMEs to be more competitive globally through the use of simulation services running on High Performance Computing Cloud infrastructure.
Today Cadence Design Systems announced several important deliveries in its collaboration with TSMC to advance 7nm FinFET designs for mobile and high-performance computing platforms. Working together, Cadence and TSMC have developed some of the first design IP offerings for the 7nm process, offering early IP access to protocols that are optimized for and most relevant to mobile and HPC applications.
Today Verne Global announced Volkswagen is moving more than 1 MW of high performance computing applications to the company’s datacenter in Iceland. The company will take advantage of Verne Global’s hybrid data center approach – with variable resiliency and flexible density – to support HPC applications in its continuous quest to develop cutting-edge cars and automotive technology.
In this special guest feature from Scientific Computing World, Wolfgang Gentzsch explains the role of HPC container technology in providing ubiquitous access to HPC. “The advent of lightweight pervasive, packageable, portable, scalable, interactive, easy to access and use HPC application containers based on Docker technology running seamlessly on workstations, servers, and clouds, is bringing us ever closer to the democratization of HPC.”
In this video from the 2016 HPC User Forum in Austin, a select panel of HPC vendors describe their disruptive technologies for high performance computing. Vendors include: Altair, SUSE, ARM, AMD, Ryft, Red Hat, Cray, and Hewlett Packard Enterprise. “A disruptive innovation is an innovation that creates a new market and value network and eventually disrupts an existing market and value network, displacing established market leading firms, products and alliances.”
“The integration of FLOW-3D with CAESES creates a powerful design environment for our users. FLOW-3D’s inherent ease of modifying geometry is even more potent when combined with an optimization tool like CAESES, which specializes in optimizing for geometry as well as other parametric studies,” said Flow Science Vice President of Sales and Business Development, Amir Isfahani.
ESI Group has signed agreement with Huawei to collaborate on on High Performance Computing and cloud computing for industrial manufacturing solutions for customers in China and worldwide. “The ongoing digital transformation of industrial manufacturing demands enterprise-level IT solutions that are more intelligent, efficient, and convenient, especially in the HPC domain,” said Zheng Yelai, President, Huawei IT Product Line.
Today the Energy Department’s Advanced Manufacturing Office announced up to $3 million in available funding for manufacturers to use high-performance computing resources at the Department’s national laboratories to tackle major manufacturing challenges. The High Performance Computing for Manufacturing (HPC4Mfg) program enables innovation in U.S. manufacturing through the adoption of high performance computing (HPC) to advance applied science and technology in manufacturing, with an aim of increasing energy efficiency, advancing clean energy technology, and reducing energy’s impact on the environment.