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GPUs Power New AWS P2 Instances for Science & Engineering in the Cloud

Today Amazon Web Services announced the availability of P2 instances, a new GPU instance type for Amazon Elastic Compute Cloud designed for compute-intensive applications that require massive parallel floating point performance, including artificial intelligence, computational fluid dynamics, computational finance, seismic analysis, molecular modeling, genomics, and rendering. With up to 16 NVIDIA Tesla K80 GPUs, P2 instances are the most powerful GPU instances available in the cloud.

Accelerating Finite Element Analysis with Intel Xeon Phi

With the introduction of the Intel Scalable System Framework, the Intel Xeon Phi processor can speed up Finite Element Analysis significantly. Using highly tuned math libraries such as the Intel Math Kernel Library (Intel MKL), FEA applications can execute math routines in parallel on the Intel Xeon Phi processor.

SGI and ANSYS Achieve New World Record in HPC

Over at the ANSYS Blog, Tony DeVarco writes that the company worked with SGI to break a world record for HPC scalability. “Breaking last year’s 129,024 core record by more than 16,000 cores, SGI was able to run the ANSYS provided 830 million cell gas combustor model from 1,296 to 145,152 CPU cores.This reduces the total solver wall clock time to run a single simulation from 20 minutes for 1,296 cores to a mere 13 seconds using 145,152 cores and achieving an overall scaling efficiency of 83%.”

Video: Using HPC to build Clean Energy Technologies

Maria Chan from NST presented this talk at Argonne Out Loud. “People eagerly anticipate environmental benefits from advances in clean energy technologies, such as advanced batteries for electric cars and thin-film solar cells. Optimizing these technologies for peak performance requires an atomic-level understanding of the designer materials used to make them. But how is that achieved? Maria Chan will explain how computer modeling is used to investigate and even predict how materials behave and change, and how researchers use this information to help improve the materials’ performance. She will also discuss the open questions, challenges, and future strategies for using computation to advance energy materials.”

Call for Proposals: Fortissimo Project

The European Fortissimo Project has issued its Second Call for Proposals. Fortissimo is a collaborative project that enables European SMEs to be more competitive globally through the use of simulation services running on High Performance Computing Cloud infrastructure.

Cadence and TSMC Advance Towards 7nm FinFET Designs

Today Cadence Design Systems announced several important deliveries in its collaboration with TSMC to advance 7nm FinFET designs for mobile and high-performance computing platforms. Working together, Cadence and TSMC have developed some of the first design IP offerings for the 7nm process, offering early IP access to protocols that are optimized for and most relevant to mobile and HPC applications.

Volkswagen Moves HPC Workloads to Verne Global in Iceland

Today Verne Global announced Volkswagen is moving more than 1 MW of high performance computing applications to the company’s datacenter in Iceland. The company will take advantage of Verne Global’s hybrid data center approach – with variable resiliency and flexible density – to support HPC applications in its continuous quest to develop cutting-edge cars and automotive technology.

Putting HPC into the Hands of Every Engineer and Scientist

In this special guest feature from Scientific Computing World, Wolfgang Gentzsch explains the role of HPC container technology in providing ubiquitous access to HPC. “The advent of lightweight pervasive, packageable, portable, scalable, interactive, easy to access and use HPC application containers based on Docker technology running seamlessly on workstations, servers, and clouds, is bringing us ever closer to the democratization of HPC.”

Video: HPC Disruptive Technologies Panel

In this video from the 2016 HPC User Forum in Austin, a select panel of HPC vendors describe their disruptive technologies for high performance computing. Vendors include: Altair, SUSE, ARM, AMD, Ryft, Red Hat, Cray, and Hewlett Packard Enterprise. “A disruptive innovation is an innovation that creates a new market and value network and eventually disrupts an existing market and value network, displacing established market leading firms, products and alliances.”

Flow Science Partners with FRIENDSHIP SYSTEMS for Optimizing Simulation

“The integration of FLOW-3D with CAESES creates a powerful design environment for our users. FLOW-3D’s inherent ease of modifying geometry is even more potent when combined with an optimization tool like CAESES, which specializes in optimizing for geometry as well as other parametric studies,” said Flow Science Vice President of Sales and Business Development, Amir Isfahani.