Engineers of the Hikari HVDC power feeding system predict it will save 15 percent compared to conventional systems. “The 380 volt design reduces the number of power conversions when compared to AC voltage systems,” said James Stark, director of Engineering and Construction at the Electronic Environments Corporation (EEC), a Division of NTT FACILITIES. “What’s interesting about that,” Stark added, “is the computers themselves – the supercomputer, the blade servers, cooling units, and lighting – are really all designed to run on DC voltage. By supplying 380 volts DC to Hikari instead of having an AC supply with conversion steps, it just makes a lot more sense. That’s really the largest technical innovation.”
“The integration of FLOW-3D with CAESES creates a powerful design environment for our users. FLOW-3D’s inherent ease of modifying geometry is even more potent when combined with an optimization tool like CAESES, which specializes in optimizing for geometry as well as other parametric studies,” said Flow Science Vice President of Sales and Business Development, Amir Isfahani.
“DDN has a long history of technological innovation, a great team and a phenomenal market opportunity,” said Triendl. “I am excited to help realize what I believe is tremendous potential to extend our unmatched delivery of performance and capacity at scale – far beyond what most can even imagine.”
Loyola University Maryland has been awarded a $280,120 grant from the National Science Foundation (NSF) to build an HPC cluster that will exponentially expand research opportunities for faculty and students across disciplines.
“The drive towards Exascale computing requires cooling the next generation of extremely hot CPUs, while staying within a manageable power envelope,” said Bob Bolz, HPC and Data Center Business development at Aquila. “Liquid cooling holds the key. Aquarius is designed from the ground up to meet reliability and the feature-specific demands of high performance and high density computing. Our design goal was to reduce the cost of cooling server resources to well under 5% of overall data center usage.”
“AMD has been away from the HPC space for a while, but now they are coming back in a big way with an open software approach to GPU computing. The Radeon Open Compute Platform (ROCm) was born from the Boltzmann Initiative announced last year at SC15. Now available on GitHub, the ROCm Platform bringing a rich foundation to advanced computing by better integrating the CPU and GPU to solve real-world problems.”
Vectorization and threading are critical to using such innovative hardware product such as the Intel Xeon Phi processor. Using tools early in the design and development processor that identify where vectorization can be used or improved will lead to increased performance of the overall application. Modern tools can be used to determine what might be blocking compiler vectorization and the potential gain from the work involved.
ESI Group has signed agreement with Huawei to collaborate on on High Performance Computing and cloud computing for industrial manufacturing solutions for customers in China and worldwide. “The ongoing digital transformation of industrial manufacturing demands enterprise-level IT solutions that are more intelligent, efficient, and convenient, especially in the HPC domain,” said Zheng Yelai, President, Huawei IT Product Line.
Over at the Nvidia Blog, Jamie Beckett writes that the company’s is expanding its Deep Learning Institute with Microsoft and Coursera. The institute provides training to help people apply deep learning to solve challenging problems.