Can 3D-stacking technology topple the long-standing “memory wall” that’s been holding back HPC application performance? A new paper from the Barcelona Supercomputing Center written in collaboration with experts from Chalmers University and Lawrence Livermore National Laboratory concludes that it will take more than just the simple replacement of conventional DIMMs with 3D-stacked devices.
[SPONSORED GUEST ARTICLE] Think of the Microsoft Azure cloud platform as analogous to a general contractor who brings together the most skilled and knowledgeable artisans, technologically speaking, offering the latest and most powerful advanced AI capabilities. This would include the latest NVIDIA AI hardware….
The high-performance computing (HPC) market is witnessing a notable shift towards the cloud, partially driven by the benefits of enhanced energy efficiency. According to Hyperion Research nearly every organization running HPC workloads is either already using or investigating the cloud to accelerate application performance, with the cloud market for HPC workloads forecast to reach $11.5 […]
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