Although liquid cooling is considered by many to be the future for data centers, the fact remains that there are some who do not yet need to make a full transformation to liquid cooling. Others are restricted until the next budget cycle. Whatever the reason, new technologies like Internal Loop are more affordable than liquid cooling and can replaces less efficient air coolers. This enables HPC data centers to still utilize the highest performing CPUs and GPUs.
Asetek showcased its full range of RackCDU hot water liquid cooling systems for HPC data centers at SC15 in Austin. On display were early adopting OEMs such as CIARA, Cray, Fujitsu, Format and Penguin. HPC installations from around the world incorporating Asetek RackCDU D2C (Direct-to-Chip) technology were also be featured. In addition, liquid cooling solutions for both current and future high wattage CPUs and GPUs from Intel, Nvidia and OpenPower were on display.
Of the varied approaches to liquid cooling, most remain technical curiosities and fail to show real-world adoption in any significant degree. In contrast, both Asetek RackCDU D2C™ (Direct-to-Chip) and Internal Loop Liquid Cooling are seeing accelerating adoption both by OEMs and end users.
Today Asetek announced an OEM purchase agreement with HPC vendor Penguin Computing. As a part of the agreement, Penguin will incorporate Asetek’s RackCDU D2C liquid cooling technology into its Tundra Extreme Scale (ES) HPC server product line. RackCDU direct-to-chip hot water liquid cooling enhances Penguin’s ability to provide HPC solutions with extreme energy efficiency and higher rack cluster densities. The agreement has already resulted in an order by Penguin described in a previously anonymous announcement.
Today Asetek announced its biggest purchase order to date for its RackCDU data center liquid cooling system. The order was placed by an undisclosed Original Equipment Manufacturing partner. The order for 21 RackCDU with Direct-to-Chip cooling loops is to satisfy an undisclosed OEM customer installation. Both the OEM and the end user will be announced when the information becomes public.
“The range of cooling options now available is testimony to engineering ingenuity. HPC centers can choose between air, oil, dielectric fluid, or water as the heat-transfer medium. Opting for something other than air means that single or two-phase flow could be available, opening up the possibilities of convective or evaporative cooling and thus saving the cost of pumping the fluid round the system.”
Today Asetek announced an order for its RackCDU data center liquid cooling system placed by FORMAT Sp. Ltd, an IT solutions provider located in Poland. Building on the success of previous smaller orders, FORMAT has ordered 6 RackCDU with cooling loops for a total of 471 compute nodes that will be delivered in Q3. The order will result in revenue to Asetek in the range of $100k.
The HPC industry’s expanded use of liquid cooling was evident at the recent ISC 2015 conference in Frankfurt. To learn more, we caught up with Steve Branton from Asetek.
Last week at ISC 2015, Fujitsu rolled out new Primergy systems using the company’s Cool-Central Liquid Cooling Solution. Based on Asetek technology, Cool-Central reduces cooling costs by up to 50 percent.
In this video from ISC 2015, Steve Branton from Asetek describes a series of high profile supercomputing upgrades that show the growing momentum of Asetek liquid cooling in the HPC market. “Asetek customers are using the company’s RackCDU Liquid Cooling for increased datacenter efficiency. See for yourself how Asetek successfully addresses datacenter demands at the University of Tromso, Mississippi State University, NREL, and elsewhere, while working with Cray, Fujitsu and other OEMs.”