Today Asetek announced a new order from one of its existing OEM partners for its RackCDU D2C (Direct-to-Chip) liquid cooling solution. The order is part of a new installation for an undisclosed HPC customer. “I am very pleased with the progress we are making in our emerging data center business segment,” said André Sloth Eriksen, CEO and founder of Asetek. “This repeat order, from one of our OEM partners, to a new end customer confirms the trust in our unique liquid cooling solutions and that adoption is growing.”
Today liquid-cooling technology provider Asetek announced that the company has signed a development agreement with a “major player” in the data center space. “This development agreement is the direct result of several years of collaboration and I am very pleased that we have come this far with our partner. I expect this is the major breakthrough we have been waiting for,” said André Sloth Eriksen, CEO and founder of Asetek.
Today Asetek announced that its server pump has achieved 200 million hours of reliable operation in real world use. Installed at end-user locations as diverse as Singapore and Norway, Asetek pumps have run fault-free for the equivalent of 22,000 years. “To date, we have not had a single server pump failure at any of our data center installations around the world,” said Mette Nørmølle, Vice President of Engineering. “Our low-pressure architecture is the key to enabling a cost-effective solution that is relied on by data centers demanding unrivaled performance and maximum uptime.”
“As seen at installations included on both the Green500 and Top500 lists, Asetek’s distributed liquid cooling architecture enables cluster energy efficiency in addition to sustained and un-throttled cluster performance,” said John Hamill, Vice President of WW Sales and Marketing. “Around the world, data centers are increasingly using Asetek technology for High Performance Computing while reducing energy costs.”
In this video from SC16, Steve Branton from Asetek describes the company’s innovative liquid cooling systems for high performance computing. Unlike one-size-fits-all approaches, the flexibility of Asetek distributed liquid cooling technology enables OEMs to provide a fit-to-need strategy that is compelling to the elite members of the supercomputing community. “With the accelerating trend of higher wattages and the continuing requirement of high density, the need for adaptable, cost effective, and reliable liquid cooling is accelerating among those striving to obtain TOP500 status. This need is exactly what Asetek’s distributed cooling architecture provides.”
If you were not able to attend SC16, have we got a video for you! Courtesy of Asetek, this time-lapse walk-through of the exhibit hall sure looks familiar to this reporter who spent the last four days shooting over 50 interviews.
“With the accelerating trend of higher wattages and the continuing requirement of high density, the need for adaptable, cost effective, and reliable liquid cooling is accelerating among those striving to obtain TOP500 status,” said John Hamill, Vice President of WW Sales and Marketing. “This need is exactly what Asetek’s distributed cooling architecture provides.”
Demonstrating Asetek’s adaptability to any data center cooling need, HPC installations from around the world are currently on display at SC16 in Salt Lake City, Utah November 14-17. Servers from these installations featuring Asetek liquid cooling will be on display including servers installed at Oakforest-PACS, the highest Performance Supercomputer System in Japan.
Datacenters that are designed for High Performance Computing (HPC) applications are more difficult to design and construct than those that are designed for more basic enterprise applications. Organizations that are creating these datacenters need to be aware of, and design for systems that are expected to run at their maximum or near maximum performance for the lifecycle of the servers.
With the release of high wattage processors liquid cooling is becoming a necessity for HPC data centers. Liquid cooling’s ability to provide the direct removal of heat from these high wattage components within the servers is well established. However, there are sometimes concerns from facilities management that need to be addressed prior to liquid cooling’s introduction to the data center.