Today Asetek announced its biggest purchase order to date for its RackCDU data center liquid cooling system. The order was placed by an undisclosed Original Equipment Manufacturing partner. The order for 21 RackCDU with Direct-to-Chip cooling loops is to satisfy an undisclosed OEM customer installation. Both the OEM and the end user will be announced when the information becomes public.
“The range of cooling options now available is testimony to engineering ingenuity. HPC centers can choose between air, oil, dielectric fluid, or water as the heat-transfer medium. Opting for something other than air means that single or two-phase flow could be available, opening up the possibilities of convective or evaporative cooling and thus saving the cost of pumping the fluid round the system.”
Today Asetek announced an order for its RackCDU data center liquid cooling system placed by FORMAT Sp. Ltd, an IT solutions provider located in Poland. Building on the success of previous smaller orders, FORMAT has ordered 6 RackCDU with cooling loops for a total of 471 compute nodes that will be delivered in Q3. The order will result in revenue to Asetek in the range of $100k.
In this video from ISC 2015, Steve Branton from Asetek describes a series of high profile supercomputing upgrades that show the growing momentum of Asetek liquid cooling in the HPC market. “Asetek customers are using the company’s RackCDU Liquid Cooling for increased datacenter efficiency. See for yourself how Asetek successfully addresses datacenter demands at the University of Tromso, Mississippi State University, NREL, and elsewhere, while working with Cray, Fujitsu and other OEMs.”
Today Asetek announced that it has been selected by CIARA, a leading supplier of enterprise servers, storage and services, to liquid cool its High Frequency server line. Based on customer expectations, Asetek expects the business to generate revenues in excess of $1,000,000 USD per year with delivery scheduled to begin in the third quarter 2015.
With the growth of big data, cloud and high performance computing, demands on data centers around the world are expanding every year. Unfortunately, these demands are coming up against significant opposition in the form of operating constraints, capital constraints, and sustainability goals. In this article, we look at 8 of these constraints and how direct-to-chip liquid cooling is solving them.