In anticipation of forthcoming product announcements, Asetek today announced an ongoing collaboration with Intel to provide hot water liquid cooling for servers and datacenters. This collaboration, which includes Asetek’s ServerLSL and RackCDU D2C technologies, is focused on the liquid cooling of density-optimized Intel Compute Modules supporting high-performance Intel Xeon Scalable processors.
Asetek Announces Ongoing Collaboration with Intel on Liquid Cooling for Servers and Datacenters
March 16, 2018 by
Tohoku University Liquid Cools HPC Systems with Asetek
January 24, 2018 by
Today Asetek announced a new order from OEM partner Fujitsu for the Institute of Fluid Science at Tohoku University in Japan. The supercomputing system will consist of multiple computational sub-systems using the latest liquid-cooled Fujitsu PRIMERGY x86 servers, and is planned to deliver a peak theoretical performance exceeding 2.7 petaflops.
Asetek Rides the Wave of Liquid Cooling for HPC at SC17
November 24, 2017 by
In this video from SC17 in Denver, Steve Branton from Asetek describes the company’s wide array of liquid cooling solutions for HPC. At the Asetek booth, the company displayed liquid cooling from recently announced OEMs and channel partners in addition to cooling solutions for the latest Intel, Nvidia and IBM CPUs, accelerators and GPUs. “We are seeing higher wattage HPC nodes that require liquid cooling as they cannot be cooled with air. Wattage density is only going to get higher with the inclusion of machine learning and AI across the HPC spectrum.”
Asetek Partners with E4 Computer Engineering, Announces Installation at CINECA
November 3, 2017 by
Today Asetek announced E4 Computer Engineering as a new datacenter OEM partner. E4 Computer Engineering has utilized Asetek RackCDU D2C (Direct-to-Chip) liquid cooling for the D.A.V.I.D.E. SUPERCOMPUTER in Italy. Commissioned by PRACE (The Partnership for Advanced Computing in Europe) and installed at CINECA (PRACE Italian hosting member), the innovative OpenPOWER-based D.A.V.I.D.E. supercomputer is built on top of the IBM POWER8 architecture.
Asetek Announces NEC as New Datacenter OEM Partner
October 31, 2017 by
Today Asetek announced NEC Corporation as a new data center OEM partner. NEC Corporation, through its subsidiary NEC Fielding, Ltd., will deploy Asetek RackCDU Direct-to-Chip liquid cooling at a new HPC installation in Japan. Asetek has already begun to make shipments in support of this installation. “Liquid cooling technology is becoming a key supercomputer component. Asetek’s direct-to-chip technology enables more effective cooling and increased computational performance in high density HPC clusters, adding value for our end-users,” said Noritaka HOSHI, (Senior Manager), NEC Corporation.
The Inflection Point of Wattage in HPC, Deep Learning and AI
October 31, 2017 by
Magnified in 2017 by machine learning and AI, there is a heightened concern in the HPC community over wattage trends in CPUs, GPUs and emerging neural chips required to meet accelerating computational demands in HPC clusters. In this sponsored post from Asetek, the company examines how high wattage trends in HPC, deep learning and AI might be reaching an inflection point.
Asetek lands new OEM, Channel Partner, and HPC Installation
September 8, 2017 by
Today Asetek announced an order from a new channel partner to service demand from a new OEM customer for an undisclosed HPC installation. All parties remain undisclosed at this time. “Adding OEMs has been a key goal for our datacenter business and it is particularly satisfying to add another significant OEM to our portfolio of customers,” said André Sloth Eriksen, CEO and founder of Asetek. “This order confirms our ability to leverage our leading position in the HPC segment to attract new customers as well as end-users.”
DOE Labs Adopt Asetek Liquid Cooling
August 1, 2017 by
Today Asetek announced two incremental orders from Penguin Computing, an established data center OEM. The orders are for Asetek’s RackCDU D2C™ (Direct-to-Chip) liquid cooling solution and will enable increased computing power for two currently undisclosed HPC sites at U.S. Department of Energy (DOE) National Laboratories.
Intel’s Xeon Scalable Processors Provide Cooling Challenges for HPC
July 25, 2017 by
Unless you reduce node and rack density, the wattages of today’s high-poweredCPUs and GPUs are simply no longer addressable with air cooling alone. Asetek explores how new processors, such as Intel’s Xeon Scalable processors, often call for more than just air cooling. “The largest Xeon Phi direct-to-chip cooled system today is Oakforest-PACS system in Japan. The system is made up of 8,208 computational nodes using Asetek Direct-to-Chip liquid cooled Intel Xeon Phi high performance processors with Knights Landing architecture. It is the highest performing system in Japan and #7 on the Top500.”
Asetek Announces Regional OEM HPC installation
July 15, 2017 by
Today Asetek announced an order from a new European OEM customer to service demand for an HPC (High Performance Computing) installation. “The order is for Asetek’s RackCDU D2C (Direct-to-Chip) liquid cooling solution and is valued at $32,000 USD with delivery scheduled for Q3 2017.”
