Today Huawei an agreement with the Institute of Technology and Renewable Energy (ITER) to provide HPC services on Tenerife, one of the Spanish-controlled Canary Islands off the west coast of Africa. “The agreement established the collaboration between ITER and Huawei to jointly develop the capacity in super-computation, smart technology, big data applications and analysis applications, in which we have made important progress,” said Carlos Antonio Rodriguez, president of the local Administrative Council that runs ITER.
Francis Lam from Huawei presented this talk at the Stanford HPC Conference. “High performance computing is rapidly finding new uses in many applications and businesses, enabling the creation of disruptive products and services. Huawei, a global leader in information and communication technologies, brings a broad spectrum of innovative solutions to HPC. This talk examines Huawei’s world class HPC solutions and explores creative new ways to solve HPC problems.
In this special guest feature from Scientific Computing World, Cray’s Barry Bolding gives some predictions for the supercomputing industry in 2017. “2016 saw the introduction or announcement of a number of new and innovative processor technologies from leaders in the field such as Intel, Nvidia, ARM, AMD, and even from China. In 2017 we will continue to see capabilities evolve, but as the demand for performance improvements continues unabated and CMOS struggles to drive performance improvements we’ll see processors becoming more and more power hungry.”
“Huawei has increasingly become more prominent in the HPC market. It has successfully deployed HPC clusters for a large number of global vehicle producers, large-scale supercomputing centers, and research institutions. These show that Huawei’s HPC platforms are optimized for industry applications which can help customers significantly simplify service processes and improve work efficiency, enabling them to focus on product development and research.”
In this video, CoolIT Systems CEO & CTO, Geoff Lyon, and STULZ ATS President, Joerg Desler, discuss high density Chip-to-Atmosphere™ data center liquid cooling solutions for organizations big or small. When integrated, CoolIT Systems’ DCLC™ solutions can capture 85% and more of the servers’ heat directly into liquid. Complimenting DCLC™, STULZ precision air cooling products capture the balance of the lower density heat. A considerable benefit forms when the total heat energy from both systems is consolidated, transported outside and then dissipated or recaptured for reuse, to heat nearby buildings, for example.
Today CERN announced that it has selected T-Systems and Huawei to design, prototype the pilot phase of the Helix Nebula Science Cloud. T-Systems and Huawei will develop a solution based on its Open Telekom Cloud public cloud service launched in March 2016 and which currently supports workloads from various leading enterprises, SMEs and public sector organizations.
“Huawei’s new-generation FusionServer X6000 HPC platform, based on the Intel Scalable System Framework, provides the balanced performance, scalability, and flexibility to efficiently handle a wide range of HPC workloads,” said Hugo Saleh, Director of Marketing and Enabling, Intel Scalable Datacenter Solutions. “The FusionServer X6000 is a great example of how Intel Xeon processors and Intel Omni-path architecture can combine to build industry leading solutions with innovative fabric features that optimize performance, resiliency, and traffic movement.”
Today Bright Computing announced expanded collaboration with Huawei across EMEA.
Huawei places win-win collaboration at the heart of our business in Europe,” said Jaco Pesschier, Senior Channel Sales Manager, Huawei West Europe Enterprise Business. “We’re committed to building a partner ecosystem which enables end-users to make the most of new ICT to become leaders in their markets. As our relationship with Bright Computing grows we look forward to a productive and optimistic future working together.”
ESI Group has signed agreement with Huawei to collaborate on on High Performance Computing and cloud computing for industrial manufacturing solutions for customers in China and worldwide. “The ongoing digital transformation of industrial manufacturing demands enterprise-level IT solutions that are more intelligent, efficient, and convenient, especially in the HPC domain,” said Zheng Yelai, President, Huawei IT Product Line.
There is still time to register for the 2016 Hot Interconnects Conference, which takes place August 24-26 at Huawei in Santa Clara, California. The keynote speaker this year is Kiran Makhijan, Senior Research Scientist, Network Technology Labs at the Huawei America Research Center. Her talk is entitled: Cloudcasting – Perspectives on Virtual Routing for Cloud Centric Network Architectures.