SUNNYVALE, Calif., Feb. 6, 2024 — Tenstorrent and Blue Cheetah Analog Design today announced that Tenstorrent has licensed Blue Cheetah’s die-to-die interconnect IP for its AI and RISC-V chiplet solutions. By selecting Blue Cheetah, Tenstorrent aims to accelerate its own as well as its customers’ and partners’ development of chiplet-based AI and RISC-V solutions. “Blue […]
Tenstorrent Selects Blue Cheetah Chiplet Interconnect IP for AI and RISC-V Solutions
February 6, 2024 by
Ayar Labs to Show 4 Tbps Optically-enabled Intel FPGA at SC23
November 8, 2023 by
SANTA CLARA, Calif. – Nov. 8, 2023 – Ayar Labs, a company developing silicon photonics for chip-to-chip connectivity, will showcase its in-package optical I/O solution integrated with Intel’s Agilex Field-Programmable Gate Array (FPGA) technology. In demonstrating 5x current industry bandwidth at 5x lower power and 20x lower latency, the optical FPGA – packaged in a common […]
Silicon Photonics and the Hunt for an HPC Bandwidth Bottleneck Breakthrough
December 19, 2022 by
[SPONSORED CONTENT] “FLOPS are cheap, moving data is expensive.” In HPC circles this sentiment is heard often. There’s a growing sense that classical HPC systems and the advanced chips that power them are pushing up against their practical limits, that some foundational new technology is needed to build more balanced systems to achieve the next […]
Ayar Labs Wins $15M Optical I/O Contract from DoD
November 10, 2022 by
SANTA CLARA, Calif. – Nov. 10, 2022 – Ayar Labs, a developer of chip-to-chip optical connectivity, was awarded a $15 million multi-year prototype Other Transaction Agreement (OTA) in support of Project KANAGAWA (the Co-Packaged Analog-Drive High-Bandwidth Optical Input/Output Project). The OTA, a non-traditional government contracting method for fast tracking research and innovation, was issued by Naval Surface […]
@HPCpodcast: CXL News, the CHIPS Act, Chips and Nm and Chip ‘Sprawl’
August 19, 2022 by
We’ve heard so much about the CXL interconnect – including the recent announcement of CXL v3.0 – and components that are CXL-ready, that it may come as a surprise that CXL v1.1 “hosts” are only just now shipping. It’s a technology that could play a central role in the ever-more heterogenous, more memory-intensive systems of the future. And now, after several years of experimentation and various interconnect consortia, CXL is emerging as the standard for advanced functionality for fabric technologies. Along with CXL we also discuss some of the details of the CHIPS and Science Act….
Post-Exascale Fabric: NNSA Awards Cornelis Networks $18M for High Performance Network R&D
May 4, 2022 by
Those who gave up for dead Intel’s Omni-Path fabric, which Intel began working on 2012 and stopped supporting seven years later, may want to re-think that. Cornelis Networks, the company breathing life into Omni-Path since 2020, has won an $18 million R&D contract from the U.S. National Nuclear Security Administration (NNSA). The award is part of DOE’s Next-Generation High Performance Computing Network (NG-HPCN) project….
PCI-SIG Releases PCIe 6.0 Specification
January 11, 2022 by
BEAVERTON, OR. – January 11, 2022 – PCI-SIG, developer of the PCI Express (PCIe) standard, today announced the official release of the PCIe 6.0 specification, reaching 64 GT/s. PCIe 6.0 specification features: 64 GT/s raw data rate and up to 256 GB/s via x16 configuration Pulse Amplitude Modulation with 4 levels (PAM4) signaling and leverages existing PAM4 available […]
Samsung Announces PCIe 5.0 SSD for Enterprise Servers
December 23, 2021 by
SEOUL – Dec. 23, 2021 – Samsung Electronics Co., Ltd. today announced the PM1743 SSD for enterprise servers, integrating the PCIe (Peripheral Component Interconnect Express) 5.0 interface with Samsung’s advanced sixth-generation V-NAND. “For over a decade, Samsung has been delivering SATA, SAS and PCIe-based SSDs that have been recognized for outstanding performance and reliability by leading […]
CXL Consortium at SC21: 1st Public Demo of Compute Express Link
November 15, 2021 by
November 15, 2021 – Beaverton, OR – The CXL Consortium, an industry standards body dedicated to advancing Compute Express Link (CXL) technology, will showcase growing momentum for CXL technology at Supercomputing (SC21), taking place at America’s Center in St. Louis, Missouri and virtually November 15-18. The CXL specification enables a high-speed, efficient interconnect between the CPU and […]
Cornelis Networks Talks High Speed Fabrics for Heterogeneous HPC-AI
November 15, 2021 by
We caught up with Phil Murphy, CEO of fabrics technology company Cornelis Networks, which has one of the most interesting vendor histories in the HPC community. Extending back to the 1990s and carrying forward extensive interconnect R&D by both Intel and Cray, Cornelis’s OmniPath is a fabric uniquely well-suited to the increasingly heterogeneous world of […]
