Today Dutch startup Asperitas rolled out Immersed Computing cooling technology for datacenters. “The company’s first market ready solution, the AIC24, ‘the first water-cooled oil-immersion system which relies on natural convection for circulation of the dielectric liquid.’ This results in a fully self-contained and Plug and Play modular system. The AIC24 needs far less infrastructure than any other liquid installation, saving energy and costs on all levels of datacentre operations. The AIC24 is the most sustainable solution available for IT environments today. Ensuring the highest possible efficiency in availability, energy reduction and reuse, while increasing capacity. Greatly improving density, while saving energy at the same time.”
“U.S. Patent 9,496,200 protects the invention of utilizing a modular, building block approach for datacenter cooling with direct contact liquid cooling,” said Geoff Lyon CEO, CoolIT Systems. “CoolIT’s commitment to developing and patenting unique solutions provides our customers with the assured competitive advantage they are looking for. The 60 patent milestone adds confirmation to CoolIT’s leadership in developing innovative liquid cooling solutions for modern data centers.”
Today Asetek announced that its server pump has achieved 200 million hours of reliable operation in real world use. Installed at end-user locations as diverse as Singapore and Norway, Asetek pumps have run fault-free for the equivalent of 22,000 years. “To date, we have not had a single server pump failure at any of our data center installations around the world,” said Mette Nørmølle, Vice President of Engineering. “Our low-pressure architecture is the key to enabling a cost-effective solution that is relied on by data centers demanding unrivaled performance and maximum uptime.”
A new supercomputer has been deployed at the Jülich Supercomputing Center (JSC) in Germany. Called QPACE3, the new 447 Teraflop machine is named for “QCD Parallel Computing on the Cell. “QPACE3 is being used by the University of Regensburg for a joint research project with the University of Wuppertal and the Jülich Supercomputing Center for numerical simulations of quantum chromodynamics (QCD), which is one of the fundamental theories of elementary particle physics. Such simulations serve, among other things, to understand the state of the universe shortly after the Big Bang, for which a very high computing power is required.”
In this special guest feature, Kim McMahon shares her perspectives on SC16. ““Faster” is the game in HPC. You can achieve speed with GPUs, FPGAs, or faster CPUs. GPUs have been around a while – you go to NVIDIA and that’s where your GPUs are. FPGAs have also been around a while, but recent market actions are now making them a more viable option: Intel’s acquisition of Altera, the maturation of the OpenCL toolchain, Microsoft’s adoption and use of Bing in their data center, AWS adding FPGAs to their cloud offerings.”
“Huawei has increasingly become more prominent in the HPC market. It has successfully deployed HPC clusters for a large number of global vehicle producers, large-scale supercomputing centers, and research institutions. These show that Huawei’s HPC platforms are optimized for industry applications which can help customers significantly simplify service processes and improve work efficiency, enabling them to focus on product development and research.”
In this video, CoolIT Systems CEO & CTO, Geoff Lyon, and STULZ ATS President, Joerg Desler, discuss high density Chip-to-Atmosphere™ data center liquid cooling solutions for organizations big or small. When integrated, CoolIT Systems’ DCLC™ solutions can capture 85% and more of the servers’ heat directly into liquid. Complimenting DCLC™, STULZ precision air cooling products capture the balance of the lower density heat. A considerable benefit forms when the total heat energy from both systems is consolidated, transported outside and then dissipated or recaptured for reuse, to heat nearby buildings, for example.
In this video from SC16, Steve Branton from Asetek describes the company’s innovative liquid cooling systems for high performance computing. Unlike one-size-fits-all approaches, the flexibility of Asetek distributed liquid cooling technology enables OEMs to provide a fit-to-need strategy that is compelling to the elite members of the supercomputing community. “With the accelerating trend of higher wattages and the continuing requirement of high density, the need for adaptable, cost effective, and reliable liquid cooling is accelerating among those striving to obtain TOP500 status. This need is exactly what Asetek’s distributed cooling architecture provides.”
If you were not able to attend SC16, have we got a video for you! Courtesy of Asetek, this time-lapse walk-through of the exhibit hall sure looks familiar to this reporter who spent the last four days shooting over 50 interviews.
“With the accelerating trend of higher wattages and the continuing requirement of high density, the need for adaptable, cost effective, and reliable liquid cooling is accelerating among those striving to obtain TOP500 status,” said John Hamill, Vice President of WW Sales and Marketing. “This need is exactly what Asetek’s distributed cooling architecture provides.”