CoolIT Systems in New York is seeking an Enterprise Account Manager with experience in Data Center infrastructure in our Job of the Week.
In this video, CoolIT Systems CEO & CTO, Geoff Lyon, reveals details on the company’s next generation liquid cooling solutions for HPC, Cloud and Enterprise markets during ISC HPC 2016 in Frankfurt. Discussion highlights include OEM server solutions, customer case studies, product launches and more. “To learn more about how CoolIT Systems products and solutions maximize data center performance and efficiency whilst significantly reducing OPEX and overall TCO, visit www.coolitsystems.com.”
In this video from ISC 2016, Steve Branton from Asetek describes the company’s innovative liquid cooling solutions for HPC. “Because liquid is 4,000 times better at storing and transferring heat than air, Asetek’s solutions provide immediate and measurable benefits to large and small data centers alike. RackCDU D2C is a “free cooling” solution that captures between 60% and 80% of server heat, reducing data center cooling cost by over 50% and allowing 2.5x-5x increases in data center server density. D2C removes heat from CPUs, GPUs, memory modules within servers using water as hot as 40°C (105°F), eliminating the need for chilling to cool these components.”
In this video from ISC 2016, Thomas Blum from Germany’s Megware describes the company’s innovative hot water cooling system. The Slide SX-LC system is cooled by 50 degree celsius water on the input side with an output water temperature of 80 degrees celsius.
In this video from ISC 2016, Olivier de Laet from Calyos describes the company’s innovative cooling technology for high performance computing. “The HPC industry is ever facing is facing the challenge of ever-increasing cooling requirements. While liquid cooling cooling looks to be the best solution, what if you could achieve the same efficiencies without out using water and pumps? Enter Calytronics, cooling technology that is as simple as a heat pipe and as performant as liquid cooling.”
Sandia National Laboratories has already seen the benefits from a major Asetek liquid cooled HPC system that has been in use for over twelve months. The 600 teraflop Sky Bridge Supercomputer with 1,848 nodes was installed using Asetek D2C in a Cray CS300-LC supercomputer cluster. With RackCDU D2C, air heat-load was cut by more than 70%, making mechanical upgrade of data center cooling unnecessary and allowing more investment in compute.
Today Asetek announced plans to showcase its liquid cooling solutions and successful installations at ISC 2016 in Frankfurt. “For the first time, Asetek will be displaying its new InRackCDU cooling solution. InRackCDU provides the option of having RackCDU mounted in the server rack. InRackCDU does not take up aisle space and includes the same monitoring features as Asetek’s VerticalRackCDU.”
Today CoolIT Systems rolled out its new CHx80 Heat Exchange Module. As part of an expanded its Rack DCLC product line, this next generation liquid-to-liquid heat exchanger provides cooling capacity with N+1 reliability to manage the most challenging, high density HPC racks. CoolIT will showcase the rack-mount CHx80 at ISC16 in Frankfurt.
Asetek will highlight its liquid cooling solutions and successful installations at ISC 2016 next week in Frankfurt. For the first time, Asetek will be displaying its new InRackCDU cooling solution. InRackCDU provides the option of having RackCDU mounted in the server rack. InRackCDU does not take up aisle space and includes the same monitoring features as Asetek’s VerticalRackCDU.
Today CoolIT Systems announced that the company will showcase its energy efficient liquid cooling technologies for HPC at ISC 2016 in Frankfurt. “Our comprehensive offering of energy efficient liquid cooling solutions at ISC16 far exceeds anything CoolIT has done in the past,” says CoolIT Systems CEO and CTO Geoff Lyon. “With Europe at the forefront of energy efficient HPC, attendees can discover how rapidly the liquid cooling market is maturing, as evidenced by our growing list of global customers and OEM partners.”