Today LiquidCool Solutions announced that CEO Herb Zien will present at IDC’s HPC User Forum, September 15-17 in Seattle.
With the rise of manycore processors, double-dense blade form factors, and wider and deeper cabinets, the size and density of HPC systems have grown more than 300 percent since 1999. This high density of “heat offenders” requires a much-more efficient method of temperature control than is possible with air cooling. And while liquid cooling is generally more efficient, not all liquid alternatives are created equal.
In this video from ISC’14, Nicolas Dube from HP describes the innovative cooling in the HP Apollo 8000 system for HPC. “Tailor-made for the HPC market, the Apollo Series combines a modular design with innovative power distribution and air- and liquid-cooling techniques for extreme performance at rack scale, providing up to four times more performance per square foot than standard rack servers.”
In this video from ISC’14, Geoff Lyon from CoolIT Systems describes the company’s innovative liquid cooling systems for HPC datacenters. “CoolIT is featuring the full spectrum of DCLC solutions which can be configured to meet a range of performance, density and efficiency requirements. On display will be the Liquid-to-Air AHx and the Liquid-to-Liquid CHx systems in 45U, 25U and 12U arrangements. The Rack DCLC product range supports ultra-high density data center designs with blade and other multi-node chassis servers.”
In this video from ISC’14, Steve Branton from Asetek describes a series of high profile supercomputing installations that show the growing momentum of Asetek liquid cooling in the HPC market. “Asetek’s liquid cooling innovations for HPC and data centres address key European issues of high energy costs, the need for “green” technology and the importance of waste energy reuse.” said André Sloth Eriksen, Founder and CEO of Asetek.