Happy April Fool’s Day! It was as always an interesting week in the world of HPC-AI, this edition of HPC News Bytes includes commentary on: Microsoft and….
HPC News Bytes 20240401: A $100B AI Data Center, Eviden Says It’s Healthy, Alibaba’s RISC-V Chip, New Optical Interconnect Group, Nvidia Fights CUDA Translation
April 1, 2024 by Leave a Comment
Photonic Fabric Company Celestial AI Closes $175M Series C
March 28, 2024 by Leave a Comment
SANTA CLARA, Calif.– Celestial AI, creator of the Photonic Fabric optical interconnect technology platform, announced it raised $175 million in its Series C funding round led by Thomas Tull’s U.S. Innovative Technology Fund (USIT). In addition to USIT, the round included participation from new and existing investors including AMD Ventures, Koch Disruptive Technologies (KDT), Temasek, […]
PCI-SIG Exploring PCIe over Optical Interconnects
August 2, 2023 by
BEAVERTON, OR. – August 2, 2023 – PCI-SIG today announced the formation of a workgroup to deliver PCI Express (PCIe) technology over optical connections. The PCI-SIG Optical Workgroup intends to be optical technology-agnostic, supporting a range of optical technologies, while potentially developing technology-specific form factors. “Optical connections will be an important advancement for PCIe architecture as they will […]
Lightelligence Announces Optical Network-on-Chip Processor
June 29, 2023 by
Boston –– June 28, 2023 –– Photonic computing company Lightelligence has introduced Hummingbird, an optical network-on-chip (oNOC) processor designed for domain-specific AI workloads. Lightelligence said Hummingbird utilizes vertically stacked packaging technologies to integrate a photonic chip and an electronic chip into a single package serving as the communications network for data centers and other high-performance […]
Ayar Labs Demos Terabit Optical Link for Co-Packaged Optics and Chip-to-Chip Connectivity
June 10, 2021 by
SANTA CLARA, Calif. — Ayar Labs announced today that it has successfully demonstrated what is said is the industry’s first terabit per second Wavelength Division Multiplexing (WDM) optical link with its TeraPHY optical I/O chiplet and SuperNova multi-wavelength optical source. The demonstration shows a fully functional TeraPHY chiplet with 8 optical ports running error free […]
Ayar Labs Demonstrates Optical Interconnect Solution on GlobalFoundries’ Silicon Photonics Manufacturing Process
December 3, 2020 by
Santa Clara, CA, Dec. 2, 2020 –Ayar Labs announced it has successfully demonstrated its patented monolithic electronic/photonic solution on GlobalFoundries’ (GF) next generation photonics technology based on its 45nm platform. This is an industry first and key milestone in providing chip-to-chip optical connectivity at scale, according to Ayar Labs, and is suited for data-hungry applications […]
Never Enough Bandwidth: Optical I/O Consortium Formed to Set Interconnect Standards
June 24, 2020 by
More than 20 companies have joined an industry consortium to establish specifications for multi-wavelength integrated optics – the emerging interconnect technology whose advocates say is critical to next-generation HPC and AI. Announced today, the CW-WDM MSA (Continuous-Wave Wavelength Division Multiplexing Multi-Source Agreement) Group, wants to build an ecosystem to work on common standards and interoperability for dense laser light sources, which in turn will enable broad adoption of optical I/O.
New Funding and DARPA Grant to Propel Optical Interconnects at Ayar Labs
April 30, 2019 by
Today Ayar Labs announced that the company has secured additional funding to fuel its growth as it drives to productize its TeraPHY optical I/O chiplets and SuperNova multi-wavelength lasers in 2019. The company aims to disrupt the traditional performance, cost, and efficiency curves of the semiconductor and computing industries by driving a” 1000x improvement” in interconnect bandwidth density at 10x lower power.
Ayar Labs Readies Optical Interconnect Silicon to Meet Industry Demand
January 24, 2019 by
Ayar Labs is leveraging its recent Series A funding to bring optical interconnect silicon to the Cloud, HPC, and Telecommunication markets. “We’re seeing significant industry interest in optical chip-to-chip connectivity– based on our assessments, the Total Addressable Market for inter-chip optical interconnect is 4x the optical transceiver market,” said Charlie Wuischpard, CEO of Ayar Labs.”
Dr Keren Bergman previews ISC Keynote on Optical Computing for HPC
June 24, 2018 by
In this special guest feature from Scientific Computing World, Dr Keren Bergman, Professor of Electrical Engineering at the School of Engineering and Applied Science, Columbia University discusses her keynote on the development of silicon photonics for HPC ahead of her Tuesday keynote presentation at ISC 2018. “So today we are able to make all the components of photonic links and this includes 50 GHz data modulators, 50 GHz receivers, nanosecond scale switches all kinds of structures and we can do wave division multiplexing into these interconnect structures. The capabilities are just enormous.”
