NCSA Simulates the Physics of Soldering

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Researchers from Northwestern University are using HPC to predict the intermetallic properties of soldered materials, which may offer new areas of research in using intermetallics in interconnects.

“Using Density-Functional Theory (DFT) codes, the researchers were able to predict various properties of metallic systems such as elastic constants, interfacial energy and bulk thermodynamics,” said Gautam Ghosh. “These properties are then related to potential behavior, allowing the researchers to predict certain intrinsic properties in solder interconnects, as an example.”