In this video from the 2013 Open Fabrics Developer Workshop, Johann George from SanDisk presents: SSD Higher Speed Devices Architectural Interconnect Impact.
You can check out more OFA videos in our Open Fabrics Worshop Video Gallery.
In this video from the 2013 Open Fabrics Developer Workshop, Johann George from SanDisk presents: SSD Higher Speed Devices Architectural Interconnect Impact.
You can check out more OFA videos in our Open Fabrics Worshop Video Gallery.
With today’s growing adoption in the AI data center of liquid cooling – essential for controlling AI cooling costs and energy usage – minimizing risk includes the use of high-quality connectors. Liquid cooling connectors are crucial ….
Highlighted in this white paper by Intersect360 Research, the fastest growing provider of HPC cloud solutions has been Microsoft Azure. Azure’s momentum is based on completeness of services and solutions for HPC, and this is reflected in the loyalty of Azure users. Microsoft Azure has a greater proportion of its HPC users likely to increase their usage in the future. Meanwhile, in recent years, HPC has seen a new surge in compute from Advanced Micro Devices, Inc. (AMD). As both AMD and Azure have surged in HPC, Microsoft is combining both with its HBv3 instances, featuring AMD EPYC 7003 processors.
It’s often said that supercomputers of a few decades ago pack less power than today’s smart watches. Now we have a company, Tiiny AI Inc., claiming to have built the world’s smallest personal AI supercomputer that can run a 120-billion-parameter large language model on-device — without cloud connectivity, servers or GPUs.
