In this episode of This Week in HPC, Michael Feldman and Addison Snell from Intersect360 Research look at recent processor announcements from the HotChips Conference.
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In this podcast, the Radio Free HPC team previews the ISC 2018 Student Cluster Competition. “Now in its seventh year, the Student Cluster Competition enables international STEM teams to take part in a real-time contest focused on advancing STEM disciplines and HPC skills development at ISC 2018 from June 25-27.” [Read More...]
This white paper evaluates system requirements for next-generation platforms and explains why conventional solutions may no longer be able to meet these requirements effectively. The paper introduces the heterogeneous 3D system- in-package (SiP) technology featured in Intel Stratix 10 FPGAs and SoCs. This technology enables next-generation platforms by powering higher bandwidth, lower power, a smaller form factor, and increased functionality and fledibility. Stratix 10 FPGAs and SoCs feature 3D SiP-based transceivers across all densities.
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