The Hot Interconnects 2015 Conference has issued its Call for Papers. The event takes place Aug. 26-28 in Santa Clara.
Hot Interconnects is the premier international forum for researchers and developers of state-of-the-art hardware and software architectures and implementations for interconnection networks of all scales, ranging from multi-core on-chip interconnects to those within systems, clusters,data centers, and clouds. Themes include cross-cutting issues spanning computer systems, networking technologies, and communication protocols for high-performance interconnection networks. This conference is directed particularly at new and exciting technology and product innovations in these areas. Contributions should focus on real experimental systems, prototypes, or leading-edge products and their performance evaluation. This year’s best papers on interconnect microarchitecture will be invited to submit extended versions of their papers to a special edition of IEEE Micro.
Topics of interest:
- Novel and innovative interconnect architectures
- Multi-core processor interconnects
- System-on-Chip Interconnects
- Advanced chip-to-chip communication technologies
- Optical interconnects
- Protocol and interfaces for inter-processor communication
- Survivability and fault-tolerance of inter-connects
- High-speed packet processing engines and network processors
- System and storage area network architectures and protocols
- High-performance host-network interface architectures
- High-bandwidth and low-latency I/O
- Pb/s switching and routing technologies
- Innovative architectures for supporting collective communication
- Novel communication architectures to support cloud & grid computing
- Centralized and distributed cloud interconnects
- Requirements driving high-performance inter-connects
- Traffic characterization for HPC systems and commercial data centers
- Software-defined networking and software overlay networks
- Software for network bring-up, configuration and performance management (OpenFlow, OpenSM)
- Data Center Networking
Paper abstracts are due April 27 and full paper submissions May 4.
Sign up for insideHPC Newsletter.
