The Hot Interconnects conference has posted their program Agenda. The event takes place Aug. 28-30 in Santa Clara, California.
Join us for our 25th year of an information-packed three-day Symposium about the latest in High Performance Interconnects. IEEE Hot Interconnects is the premier international forum for researchers and developers of state-of-the-art hardware and software architectures and implementations for interconnection networks of all scales, ranging from multi-core on-chip interconnects to those within systems, clusters, and data centers. Leaders in industry and academia attend the conference to interact with individuals at the forefront of this field.
Two days of technical sessions and a day of tutorials are waiting for you, to keep you on the top of the latest developments in industry and academia.
Speakers include:
- D. K. Panda & Xiaoyi Lu, Ohio State University
- Pavel Shamis, ARM
- Yossi Itigin, Mellanox Technologies
- Sean Hefty, Intel
- Nikhil Jain, LLNL
- Misbah Mubarak, Argonne
- Chuanxiong Guo, MSR
- Torsten Hoefler, ETH Zurich
- Nandita Dukkipati, Google (Invited Talk)
- Dave Cohen, Senior Principal Engineer & System Architect, Intel
- Pete Fiacco, CTO, GigaIO Networks
- Dave Meyer, Chief Scientist, Brocade
- Yogesh Bhatt, Senior Director, Ecosystem Innovation & Strategy, Ericsson
- David Allan, Ericsson
