Asetek Announces Regional OEM HPC installation

Print Friendly, PDF & Email

Today Asetek announced an order from a new European OEM customer to service demand for an HPC (High Performance Computing) installation.

The order is for Asetek’s RackCDU D2C (Direct-to-Chip) liquid cooling solution and is valued at $32,000 USD with delivery scheduled for Q3 2017.

All parties remain undisclosed at this point.

In this video from ISC 2017, Steve Branton from Asetek describes how the company’s innovative liquid cooling solutions are gaining momentum throughout the HPC space.

“Asetek’s cost- and energy efficient liquid cooling solutions for HPC and data centers are on display at booth #J-600. Asetek’s engineers and sales team, including Mandarin-speaking staff, are present to showcase Asetek’s innovative solutions.

The 2016 TOP500 and Green500 lists include nine installations that uses Asetek liquid cooling, including Japan’s fastest computer, the Oakforest-PACS supercomputer in Tokyo (ranked #6 on both lists). Today, an increasing number of HPC installations deploy Asetek technology with existing installations expanding and new ones coming onboard.

Liquid cooling is becoming the new norm in the face of skyrocketing wattages by CPUs, GPUs and cluster nodes. Asetek cooling solutions are currently provided by OEMs such as Cray, Fujitsu, Format, Penguin.Liquid cooling for NVIDIA P100, Intel Knight’s Landing and Skylake will be on display at Asetek’s booth #J-600 as well as rack-level options such as InRackCDU and Vertical RackCDU.

2017 is the inflection point for HPC cooling. We are seeing higher wattage clusters that will need liquid cooling so they can operate. It is a clear sign that liquid cooling is becoming the new norm. We are also seeing new HPC installations come onboard – a clear signal that our technology in making an impact on the industry,” said John Hamill, Asetek Chief Operating Officer.

See our complete coverage of ISC 2017

Sign up for our insideHPC Newsletter