Liquid Cooling Ecosystem Expands for HPC with CoolIT Systems

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In this video, CoolIT Systems debuts high TDP processor coldplates, STULZ Micro Data Center with Rack DCLC™, and new liquid cooled OEM servers at ISC High Performance 2017 in Frankfurt Germany.

On June 14, CoolIT Systems, in partnership with STULZ, announced a liquid cooled micro data center for High Performance Computing applications. The unified solution, named STULZ Micro DC, combines CoolIT’s industry-leading efficient Direct Contact Liquid Cooling technology (Rack DCLC) with STULZ’ world-renowned mission critical air cooling products to create a single enclosed solution for managing high-density compute requirements.

The Micro DC is a compact data center that can be easily deployed in any environment while managing an incredible amount of power and performance,” said Joerg Desler, President of STULZ USA. “It’s modular system is configured to use various combinations of liquid and air cooling allowing the system to grow with the customer’s needs. Integrating STULZ technology with CoolIT Systems Rack DCLC has resulted in ultra-efficient total thermal solutions that can support any OEM server at even the

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