DOE Labs Adopt Asetek Liquid Cooling

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Today Asetek announced two incremental orders from Penguin Computing, an established data center OEM. The orders are for Asetek’s RackCDU D2C (Direct-to-Chip) liquid cooling solution and will enable increased computing power for two currently undisclosed HPC sites at U.S. Department of Energy (DOE) National Laboratories.

The orders have a combined value of approximately USD $280,000 with delivery expected in September 2017.

“The awards through our OEM partner Penguin, comes after months of uncertainty surrounding DOE budgets due to the new administration in the USA. They are in line with our goal of increasing end-user adoption with existing OEMs and confirm our ability to expand our leading position in the HPC segment,” said André Sloth Eriksen, CEO and founder of Asetek.

The orders are a continuation of the partnership between Penguin and Asetek in support of a number of DOE National Laboratories implementing Asetek’s RackCDU D2C liquid cooling technology in Penguin’s Tundra Extreme Scale (ES) HPC server product line. RackCDU direct-to-chip hot water liquid cooling enhances Penguin’s ability to provide HPC solutions with extreme energy efficiency and higher rack cluster densities.

In this video from ISC 2017, Steve Branton from Asetek describes how the company’s innovative liquid cooling solutions are gaining momentum throughout the HPC space.

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