Today Asetek announced NEC Corporation as a new data center OEM partner. NEC Corporation, through its subsidiary NEC Fielding, Ltd., will deploy Asetek RackCDU Direct-to-Chip liquid cooling at a new HPC installation in Japan. Asetek has already begun to make shipments in support of this installation. This follows the announcement of an undisclosed OEM partner on August 7th, 2017.
Liquid cooling technology is becoming a key supercomputer component. Asetek’s direct-to-chip technology enables more effective cooling and increased computational performance in high density HPC clusters, adding value for our end-users,” said Noritaka HOSHI, (Senior Manager), NEC Corporation.
Asetek RackCDU D2C is a hot water liquid cooling solution that captures between 60% and 80% of server heat, reducing data center cooling cost by over 50% and allowing 2.5x-5x increases in data center server density.
We are pleased to work with NEC on this project and look forward to further collaboration in the future,” said John Hamill, Asetek Chief Operating Officer. “Partnering with leading OEMs such as NEC is a cornerstone of our strategy to develop the emerging data center market.”
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