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COMSOL Conference Showcases Next-Gen Multiphysics

Svante Littmarck, President and CEO, COMSOL

Attendees of the COMSOL Conference in Boston this week were treated to a sneak preview future developments of the popular multiphysics software from Svante Littmarck, President and CEO of COMSOL. The conference featured a robust technical program with approximately 300 attendees.

Our customers are at the forefront of innovation behind the products that will shape our future,” says Littmarck. “We work tirelessly to support their efforts by increasing the modeling power of the COMSOL software and by making collaboration among simulation experts and their colleagues the core of everything we do. This annual event is our opportunity to connect and exchange knowledge within the COMSOL community on multiphysics modeling.”

Looking Ahead at the Upcoming Release:

  • Acoustics and acoustic-structure interactions based on a hybrid boundary element-finite element (BEM-FEM) method
  • Impulse response for ray acoustics
  • Magnetostatics based a hybrid boundary element-finite element (BEM-FEM) method
  • Shape memory alloy (SMA) materials for structural analysis
  • Revolutionary new method for capacitively-coupled plasma (CCP) simulations
  • Support for 3DConnexion SpaceMouse devices
  • Turbulent-flow enabled inlets for CFD simulations
  • 150 new materials and 1300 new material properties in the Material Library product
  • More than 60 substrate material properties for RF and microwave analysis

We are excited to now offer acoustics analysis based also on the boundary element method. It’s a great addition that many of our users have been waiting for,” says Mads Jensen, Technical Product Manager, Acoustics, at COMSOL. “By combining boundary element, finite element, and ray acoustics analysis in a multiphysics environment, our users get unprecedented modeling power. Users can now efficiently analyze the full range of acoustic frequencies from the lowest bass notes to ultrasound. Not to mention all the possible multiphysics couplings.”

Those in attendance had the opportunity to test the beta version of the software to try out this new feature, along with many updates to be announced later this year.

The COMSOL Conference exhibit featured technical computing software and services, hardware providers, and HPC specialists among others. A wide span of breakout sessions included minicourses and technical workshops on topics ranging from heat transfer, and structural mechanics, to meshing, solvers, optimization, postprocessing, cluster computing, and more.

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