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Asetek Rides the Wave of Liquid Cooling for HPC at SC17

In this video from SC17 in Denver, Steve Branton from Asetek describes the company’s wide array of liquid cooling solutions for HPC. At the Asetek booth, the company displayed liquid cooling from recently announced OEMs and channel partners in addition to cooling solutions for the latest Intel, Nvidia and IBM CPUs, accelerators and GPUs.

“We are seeing higher wattage HPC nodes that require liquid cooling as they cannot be cooled with air. Wattage density is only going to get higher with the inclusion of machine learning and AI across the HPC spectrum.”

Asetek showcased the flexibility of their cooling architecture with a variety of heat rejection options for HPC clusters and datacenters. They also showcased a new cooling technology for datacenters where ‘computing blocks’ of servers share a rack mounted HEX.

Asetek liquid cooling solutions for HPC data centers include RackCDU D2C (Direct-to-Chip), and ServerLSL (Server Level Sealed Loop). RackCDU D2C provides cooling energy savings greater than 50% and density increases of 2.5x-5x. ServerLSL provides liquid assisted air cooling for server nodes, replacing less efficient air coolers and enabling the servers to incorporate the highest performing CPUs and GPUs.

See our complete coverage of SC17

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