In this video from ISC 2018, Joe Yaworski from Intel describes how the newly announced Intel® Omni-Path fabric, Intel® OPA200 interconnect will speed up HPC and AI applications.
“For both supercomputing and traditional HPC clusters, Intel continues to deliver and innovate high-speed interconnect technologies that enable cost-effective deployment of HPC systems. Intel shared at ISC its next-generation Omni-Path Architecture (Intel® OPA200), coming in 2019, which will provide data rate speeds up to 200 Gb/s, doubling the performance of the previous generation. This next-generation fabric will be interoperable and compatible with the current generation of Intel® OPA. Intel® OPA200’s high-performance capabilities and low-latency at scale will provide system architects the ability to scale to tens of thousands of nodes while benefiting from improved total cost of ownership.”
