Asetek Liquid Cooling comes to Latest Intel Compute Modules at ISC18

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Today Asetek announced plans to showcase its latest liquid cooling technology integrated in Intel Compute Modules at ISC 2018 in Frankfurt.

Asetek is excited with this next step in the ongoing collaboration with Intel,” said John Hamill, Asetek Chief Operating Officer. “The integration of Asetek liquid cooling technology in Intel Compute Modules HNS2600BPBLC and HNS7200APRL serves as further validation of low pressure distributed liquid cooling for HPC and Data Center sites.”

The release of these new liquid cooled compute modules from Intel is a direct result of the ongoing collaboration between Intel and Asetek announced in March 2018.

Both Intel Server Board S2600BP-based and Intel Server Board S7200APR- based Data Center Blocks have been validated with Asetek technology for HPC and Data Center environments.

The Intel Compute Module HNS2600BPBLC features Intel Xeon Scalable Processors with Asetek Direct-to-Chip (D2C) liquid-cooling. This product is targeted for liquid cooled data centers and utilizes Asetek’s RackCDU to transfer the heat captured from the compute modules to facilities liquid. This allows data center operators to realize increases in rack density and reduction in data center cooling costs.

The Intel Compute Module HNS7200APRL features Intel Xeon Phi Processors with Liquid to Air Assisted (LAAC) technology, allowing the heat captured by the liquid to be expelled by traditional data center air handling. This allows the use of higher performance processors in dense configurations, without any changes to the data center infrastructure.

Our customers want to use the high-performance Intel processors, and often in very dense configurations,” said Mike Kendrick, HPC Segment Lead, Intel Data Center Solutions Group. “These solutions are examples of how we can provide users the choice of using liquid to boost performance in existing air-cooled data centers or to maximize performance and density in liquid cooled data centers.”

Intel Compute Modules featuring both Intel Xeon Scalable Processors and Intel Xeon Phi Processors will be on display at booth #H-722 at ISC 2018.

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