Today CPC (Colder Products Company) introduced its new PLQ2 high-performance thermoplastic connector. These QDs deliver new capabilities in tensile strength, creep resistance and temperature handling for high performance computing and data center liquid cooling applications. Made of polyphenylsulfone (PPSU), the connectors offer a heat deflection temperature of more than 200°C and are chemically compatible with almost all of today’s most widely used coolants and engineered fluids.
PLQ Series QDs are among the highest-performing engineered polymer connectors for liquid cooling applications available. They vastly reduce concerns around plastic QD durability and performance,” said Elizabeth Langer, senior design engineer, thermal management. “HPC and data center specifiers and operators can use these plastic QDs with confidence.”
Until now, users seeking the lightweight and corrosion-resistant benefits of plastic QDs typically sacrificed some level of robustness. With the PLQ Series, that tradeoff is no longer necessary. The PLQ Series’ advanced polymer construction maintains excellent thermo-oxidative stability and long-term material performance over time. PLQ QDs operate in temperatures from 0°F to 240°F (-17° to 115°C). Dimensionally stable PPSU has low water absorption making PLQ QDs ideal for water-cooled systems and humid environments. As a thermal insulator, PPSU reduces potential condensation on the connector and eases handling—the QD will not be hot to the touch when warm fluid is present. The PPSU connector is inherently flame retardant with a UL94 V-0 rating.
PLQ Series QDs feature a multilobed seal for redundant protection against leakage and lasting shape retention during extended periods of connection. Multilobe seals provide greater sealing efficiency than standard O-rings while requiring less force to connect. The non-spill design allows disconnection under pressure without leaks—essential in protecting electronics from exposure to fluid and enabling hot swapping of equipment.
CPC is known for its easy-to-connect, robust non-spill connectors for HPC, data centers and other critical thermal management applications. A proven performer, the PLQ2 connector has undergone more than 10,000 cycles of leak testing as well as fluid burst pressure, creep resistance testing and more. CPC’s extensive manufacturing validation process also includes both 100% function and leak testing during production.
CPC will showcase the new PLQ2 Series at booth #3926 at SC18 in Dallas next week.
