In this video, NEC’s Oliver Tennert and AMD’s Dan Bounds describe how the two companies are developing high density computing solutions using AMD EPYC processors and liquid cooling for the aerospace and automotive industries.
More and more datacenters put a lot of efforts into reducing their cooling costs even further by making the leap to direct hot-water cooling. In this concept the water has an inlet temperature of up to 45 degrees Celsius and directly cools CPU, memory and other equipment by elements that are part of a closed water circuit. NEC works together with AMD to enable the best solution for each datacenter.
EPYC strikes the perfect balance of cores/threads, memory, I/O bandwidth and security to deliver excellent performance for many High Performance Computing workloads.
