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Call for Papers: Hot Interconnects Conference in Silicon Valley

The Hot Interconnects conference has issued its Call for Papers. The event takes place August 14-16 in Silicon Valley.

Hot Interconnects is the premier international forum for researchers and developers of state-of-the-art hardware and software architectures and implementations for interconnection networks of all scales, ranging from multi-core on-chip interconnects to those within systems, clusters, datacenters and Clouds. This yearly conference is attended by leaders in industry and academia. The atmosphere provides for a wealth of opportunities to interact with individuals at the forefront of this field.

Conference themes include cross-cutting issues spanning computer systems, networking technologies, and communication protocols for high-performance interconnection networks. This conference is directed particularly at new and exciting technology and product innovations in these areas. Contributions should focus on real experimental systems, prototypes, or leading-edge products and their performance evaluation.

Topics include:

  • Novel and innovative interconnect architectures
  • Multi-core processor interconnects
  • System-on-Chip Interconnects
  • Advanced chip-to-chip communication technologies
  • Optical interconnects
  • Protocols and interfaces for inter-processor communication
  • Survivability and fault-tolerance of interconnects
  • High-speed packet processing engines and network processors
  • System and storage area network architectures and protocols
  • High-performance host-network interface architectures
  • High-bandwidth and low-latency I/O
  • Pb/s switching and routing technologies
  • Innovative architectures for supporting collective communication
  • Novel communication architectures to support cloud computing
  • Centralized and distributed cloud interconnects
  • Requirements driving high-performance interconnects
  • Traffic characterization for HPC systems and commercial datacenters
  • Software for Network/Fabric Bring-up, Configuration and Performance
    Management, e.g., OpenFlow or OpenSM
  • Data Center networking

Join us for our 26th year of an information-packed three-day Symposium about the latest in High Performance Interconnects. IEEE Hot Interconnects is the premier international forum for researchers and developers of state-of-the-art hardware and software architectures and implementations for interconnection networks of all scales, ranging from multi-core on-chip interconnects to those within systems, clusters, and data centers. Leaders in industry and academia attend the conference to interact with individuals at the forefront of this field. Two days of technical sessions and a day of tutorials are waiting for you, to keep you on the top of the latest developments in industry and academia.

Submissions are due May 10, 2019.

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