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Cooling Challenges for Ultra-high Density Compute Clusters

Miguel Terol is an HPC Architect & Solutions Architect Team Lead
at Lenovo.

In this video from HPCKP’19, Miguel Terol from Lenovo presents: Cool Computing – Challenges for ultra-high density compute clusters.

With the normalization of HPC in the industry, outside the research and academic environments, as well as the burst of Big Data and AI use cases in all sectors, the demand for resources for compute and data hungry applications is increasing exponentially. Therefore, multiplying the horsepower of our compute clusters is a must. In order to make it happen, technology players are refining their chip and platform designs to enable much denser systems. The trade-off of this trend is chips are getting more and more power hungry, and cooling those components becomes a challenge in terms of sustainability, either for the environment or the economy. In this talk we will present the high density technology landscape and different approaches to address the cooling challenges.

Miguel Terol has a degree in Mathematical Sciences from the Complutense University of Madrid. He has 20 years of experience in the ICT sector, having worked in software development, systems administration, control systems design and IT infrastructure. For the past 12 years he has worked as an HPC Solutions Architect at Silicon Graphics, IBM and Lenovo. Currently, he also manages the Solutions Architecture area of ​​Lenovo Data Center Group.

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